1. Home
  2. Semiconductor Equipment
  3. Test / Inspection Equipment
  4. Wafer Automated Optical Inspection (AOI) Equipment
Filters

Wafer Automated Optical Inspection (AOI) Equipment - Page 3

38 Wafer Automated Optical Inspection (AOI) Equipment from 17 Manufacturers meet your specification.
AXION Image
 Download Datasheet  Request Information  Product Details

PARMI Co., Ltd - AXION

Wafer Automated Optical Inspection (AOI) Equipment from PARMI Co., Ltd
 Download Datasheet  Request Information
Bottom Edge Clearance:
3.3 mm
Camera:
4 MP
Conveyor Height:
860 to 970 mm
Conveyor Speed:
200 to 400 mm/sec
Defects:
Die Tilt, Chipping, Misalignment, Crack, Epoxy Coverage, Runout Measurement, Bridge, Height, Area, Volume, Coplanarity, Cu Clip Height, Fillet Coverag...
Height Accuracy:
2 µm
Height Repeatability:
3 sigma < 3 µm
Light Source:
R.G.B LED 3 Stage Lightings
Magazine Size:
305 x 120 x 200 mm
Max Component Height:
5 mm, 15 mm
Net Weight:
1100 kg
Overall Dimensions:
1770 x 1419 x 1576 mm
Resolution:
3.5 x 3.5 µm, 7 x 7 µm
Top Clearance:
3 mm
Top Edge Clearance:
3.3 mm
Type:
AOI for Semiconductor Packaging
Wafer Size:
300 x 115 mm
Wafer Thickness:
0.08 to 1 mm
more info
ZI-2000 Image
 Download Datasheet  Request Information  Product Details

SCREEN Semiconductor Solutions Co., Ltd - ZI-2000

Wafer Automated Optical Inspection (AOI) Equipment from SCREEN Semiconductor Solutions Co., Ltd
 Download Datasheet  Request Information
Light Source:
RGB 3-color LED Lighting
Overall Dimensions:
1400 x 1250 x 2030 mm
Resolution:
1.5 x 1.5 µm, 4 x 4 µm
Type:
Wafer Pattern Inspection
Wafer Size:
76 to 200 mm
more info
MA6503D Image
 Download Datasheet  Request Information  Product Details

Spirox Corporation - MA6503D

Wafer Automated Optical Inspection (AOI) Equipment from Spirox Corporation
 Download Datasheet  Request Information
Accuracy:
1.7 µm
Defect Size:
5 µm
Defects:
Particles on Surface, Scratches, Pad Defect, Bump Defect, Pad PMI Inspection, Auto Pad Quick Selection, 3D Bump Height Measurement
Field of View:
24 x 300 mm
Magnification:
3X
Stage Flatness:
15 µm
Type:
Micro Inspection
Wafer Size:
8 Inches, 12 Inches
Wafer Thickness:
300 to 2000 µm
Z Resolution:
5 µm
more info
Stratus III Image
 Download Datasheet  Request Information  Product Details

Stratus Vision GmbH - Stratus III

Wafer Automated Optical Inspection (AOI) Equipment from Stratus Vision GmbH
 Download Datasheet  Request Information
Accuracy:
2 µm
Air Supply:
6 bar, 40 L/min
Camera:
5 MP, 20 MP
Inspection Speed:
600 mm/sec
Light Source:
Multiple Toplights
Net Weight:
850 kg
Operating Temperature:
18.5 Degree C
Overall Dimensions:
1484 x 1000 x 2128 mm
Power Supply:
220 V AC 110 V AC, 50/60 Hz, 0.5 kW
Repeatability:
0.8 µm
Resolution:
3.5 µm to 10 µm
Type:
Wafer AOI
more info
WM-10R Image
 Download Datasheet  Request Information  Product Details

Takano Co.,Ltd - WM-10R

Wafer Automated Optical Inspection (AOI) Equipment from Takano Co.,Ltd
 Download Datasheet  Request Information
Cassette Load Port:
Open Cassette/FOUP/FOSB (1 or 2)
Overall Dimensions:
1482 x 1229 x 1960 mm
Sensitivity:
48 nm @ Bare-Wafer
Type:
Wafer AOI
Wafer Size:
300 mm
more info
WM-7SR Image
 Download Datasheet  Request Information  Product Details

Takano Co.,Ltd - WM-7SR

Wafer Automated Optical Inspection (AOI) Equipment from Takano Co.,Ltd
 Download Datasheet  Request Information
Cassette Load Port:
Open Cassette
Overall Dimensions:
860 x 905 x 1655 mm
Sensitivity:
79 nm @ Bare-Wafer
Type:
Wafer AOI
Wafer Size:
200 mm
more info
Vi-4207R, C Image
 Download Datasheet  Request Information  Product Details

Takano Co.,Ltd - Vi-4207R, C

Wafer Automated Optical Inspection (AOI) Equipment from Takano Co.,Ltd
 Download Datasheet  Request Information
Cassette Load Port:
Open Cassette
Defect Size:
1.2 µm, 2.4 µm, 5 µm
Defects:
Foreign Material, Chipping, Crack, Residue, Bumo Failure
Light Source:
Coxial, Ring, Under Light
Magnification:
10X, 5X, 2.5X
Net Weight:
1650 kg
Overall Dimensions:
2280 x 1140 x 2060 mm
Resolution:
15 µm, 10 µm, 5 µm, 3 µm
Type:
Pattern Inspection System
Wafer Size:
200 mm
more info
Vi-4307M, C Image
 Download Datasheet  Request Information  Product Details

Takano Co.,Ltd - Vi-4307M, C

Wafer Automated Optical Inspection (AOI) Equipment from Takano Co.,Ltd
 Download Datasheet  Request Information
Cassette Load Port:
Open Cassette, FOUP, FOSB
Defect Size:
1.2 µm, 2.4 µm, 5 µm
Defects:
Foreign Material, Chipping, Crack, Residue, Bumo Failure
Light Source:
Coxial, Ring, Under Light
Magnification:
10X, 5X, 2.5X
Net Weight:
1700 kg
Overall Dimensions:
2280 x 1140 x 2060 mm
Resolution:
15 µm, 10 µm, 5 µm, 3 µm
Type:
Pattern Inspection System
Wafer Size:
300 mm
more info
Vi-5301M Image
 Download Datasheet  Request Information  Product Details

Takano Co.,Ltd - Vi-5301M

Wafer Automated Optical Inspection (AOI) Equipment from Takano Co.,Ltd
 Download Datasheet  Request Information
Defect Size:
1.2 µm, 2.4 µm, 5 µm
Defects:
Foreign Material, Chipping, Crack, Residue, Bumo Failure
Light Source:
Coxial, Ring, Under Light
Magnification:
10X, 5X, 2.5X
Net Weight:
2800 kg
Overall Dimensions:
2600 x 1440 x 1790 mm
Resolution:
15 µm, 10 µm, 5 µm, 3 µm
Type:
Pattern Inspection System
Wafer Size:
300 mm
more info
TR7900Q SII Image
 Download Datasheet  Request Information  Product Details

Test Research, Inc - TR7900Q SII

Wafer Automated Optical Inspection (AOI) Equipment from Test Research, Inc
 Download Datasheet  Request Information
Bottom Clearance:
10 mm
Camera:
25 MP
Defects:
Missing Die, Orientation, Shift, Chipping, Crack, Scratch, Bond Line Thickness, Epoxy on Die, Epoxy Coverage, Epoxy Height, Broken Wire, Collapse, Loo...
Light Source:
Multi-phase True Color LED
Magazine Size:
320 x 175 x 150 mm
Net Weight:
823 kg
Overall Dimensions:
2065 x 1490 x 1700 mm
Resolution:
2.5 µm
Top Clearance:
7 mm
Top Edge Clearance:
3 mm
Type:
Wafer Die Inspection & Wafer Wire Bond Inspection
Wafer Size:
285 x 150 mm
Wafer Thickness:
0.1 to 1.5 mm
more info
Have a Custom Requirement?
Wafer Automated Optical Inspection (AOI) Equipment Directory