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Wafer Automated Optical Inspection (AOI) Equipment - Page 4

38 Wafer Automated Optical Inspection (AOI) Equipment from 17 Manufacturers meet your specification.
TR7720S Image
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Test Research, Inc - TR7720S

Wafer Automated Optical Inspection (AOI) Equipment from Test Research, Inc
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Bottom Clearance:
40 mm
Camera:
12 MP
Conveyor Height:
880 to 920 mm
Defects:
Missing Die, Orientation, Shift, Rotation, Chipping, Scratch, Crack, Epoxy on Die
Inspection Speed:
10.3 cm²/sec
Light Source:
Multi-phase True Color LED, Coaxial Lighting
Net Weight:
710 kg
Overall Dimensions:
750 x 1460 x 1700 mm
Resolution:
5.5 µm
Top Clearance:
25 mm
Top Edge Clearance:
3 mm
Type:
Wafer Die Inspection & Wafer Wire Bond Inspection
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Wirebond AOI Machine Image
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TT Vision Holdings Berhad - Wirebond AOI Machine

Wafer Automated Optical Inspection (AOI) Equipment from TT Vision Holdings Berhad
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Accuracy:
2.7 µm
Camera:
67 MP
Defects:
Epoxy Defect
Production Throughput:
30000 uph
Type:
Wafer Wire Bond Inspection
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F2X Image
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TT Vision Holdings Berhad - F2X

Wafer Automated Optical Inspection (AOI) Equipment from TT Vision Holdings Berhad
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Accuracy:
0.55 mm
Camera:
25 MP
Defects:
Sawing
Production Throughput:
16 wph
Type:
Wafer AOI
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F271 Image
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TT Vision Holdings Berhad - F271

Wafer Automated Optical Inspection (AOI) Equipment from TT Vision Holdings Berhad
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Camera:
16000 pixels
Defects:
Etching Defects, Mechanical Defects, Plating Defects
Production Throughput:
500 Strips per/hrs
Type:
Substrate Package AOI
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S6053BO-V Image
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Viscom AG - S6053BO-V

Wafer Automated Optical Inspection (AOI) Equipment from Viscom AG
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Air Supply:
4 to 6 bar
Bonding Type:
Ball bond, wedge bond, wire, die/SMD, ribbon
Conveyor Height:
860 to 1180 ± 20 mm
Inspection Speed:
1000 wire bond connections/min
Net Weight:
800 kg
Overall Dimensions:
1000 x 1615 x 1055 mm
Power Supply:
400 V, 3P/N/PE
Resolution:
Up to 2.5 µm
Top Clearance:
Up to 35 mm
Type:
Wafer Wire Bond Inspection
Wafer Size:
280 x 300 mm, 280 x 130 mm, 210 x 130 mm
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X7056-II BO Image
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Viscom AG - X7056-II BO

Wafer Automated Optical Inspection (AOI) Equipment from Viscom AG
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Air Supply:
4 to 8 bar
Bottom Clearance:
50 mm
Camera:
1 MP
Conveyor Height:
860 to 980 ± 20 mm
Field of View:
23 x 23 mm
Net Weight:
2245 kg
Overall Dimensions:
1493 x 1631 x 2251 mm
Power Supply:
400 V, 3P/N/PE
Resolution:
4.5 µm
Top Clearance:
Up to 25 mm
Top Edge Clearance:
3 mm
Type:
Wafer Wire Bond Inspection
Wafer Size:
Up to 450 x 350 mm
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Wi8 i G2 Image
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ViTrox Corporation Berhad - Wi8 i G2

Wafer Automated Optical Inspection (AOI) Equipment from ViTrox Corporation Berhad
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Accuracy:
2.5 µm, 1.25 µm, 0.5 µm
Field of View:
12.8 x 12.8 mm, 6.4 x 6.4 mm, 2.5 x 2.5 mm
Magnification:
1X, 2X, 5X
Type:
Wafer AOI
Wafer Size:
Up to 300 mm
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NanoPro-100 Image
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Zhonggui Optoelectronic Equipment Co., Ltd - NanoPro-100

Wafer Automated Optical Inspection (AOI) Equipment from Zhonggui Optoelectronic Equipment Co., Ltd
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Defect Size:
0.13 to 0.18 µm
Die Size:
100 nm
IC Post Processing:
300 nm
IC Pre Process:
130 nm
Production Throughput:
61 wph
Type:
Wafer AOI
Wafer Size:
8 Inches, 12 Inches
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