Wafer Probe System - Page 12

124 Wafer Probe System from 18 Manufacturers meet your specification.
Chuck Size:
12 x 12 Inches
Magnification:
20 to 4000X
Net Weight:
300 kg
Overall Dimensions:
1300 x 920 x 920 mm
Platen Travel Size:
2 x 2 Inches
Power Supply:
220VC, 50/60 Hz
Probe Rotation:
360 Degree
Resolution:
1 µm
Stage Travel Range Fine:
8 x 8 x 8 mm, 12 x 12 x 12 mm
Type:
Manual
Wafer Size:
12 Inches
Z Travel Area:
50.8 mm
more info
Chuck Size:
8 x 8 Inches
Magnification:
20 to 4000X
Net Weight:
280 kg
Operating Temperature:
-80 to 200 Degree C
Overall Dimensions:
880 x 860 x 1550 mm
Probe Rotation:
360 Degree
Pulse Width:
0 to 2.2 mJ/pulse
Resolution:
1 µm
Stage Travel Range Fine:
8 x 8 x 8 mm, 12 x 12 x 12 mm
Type:
Semi Automatic
Wafer Size:
12 Inches
Wavelength:
1064 nm, 532 nm, 355 nm, 266nm
Z Travel Area:
50.8 mm
more info
Chuck Size:
350 x 365 mm
Net Weight:
1500 kg
Operating Temperature:
-60 to 300 Degree C
Overall Dimensions:
1060 x 1610 x 1500 mm
Repeatability:
1 µm
Resolution:
0.1 µm
Type:
Semi Automatic
Wafer Size:
6 Inches, 8 Inches, 12 Inches
XY Moving Speed:
700 mm/sec
Z Repeatability:
1 µm
Z Travel Area:
20 mm
more info
Chuck Size:
350 x 365 mm
Net Weight:
1500 kg
Operating Temperature:
-60 to 300 Degree C
Overall Dimensions:
1060 x 1610 x 1500 mm
Repeatability:
1 µm
Resolution:
0.1 µm
Type:
Semi Automatic
Wafer Size:
6 Inches, 8 Inches, 12 Inches
XY Moving Speed:
700 mm/sec
Z Repeatability:
1 µm
Z Travel Area:
20 mm
more info
Chuck Size:
350 x 365 mm
Net Weight:
1500 kg
Operating Temperature:
-60 to 300 Degree C
Overall Dimensions:
1060 x 1610 x 1500 mm
Repeatability:
1 µm
Resolution:
0.1 µm
Type:
Semi Automatic
Wafer Size:
6 Inches, 8 Inches, 12 Inches
XY Moving Speed:
700 mm/sec
Z Repeatability:
1 µm
Z Travel Area:
20 mm
more info
Chuck Size:
260 x 450 mm
Die Size:
300 to 100000 µm
Net Weight:
1200 kg
Overall Dimensions:
1124 x 1111 x 925 mm
Power Supply:
AC 220V, 50/60 Hz
Repeatability:
1 µm
Resolution:
0.1 µm
Theta Movement:
10 Degree
Theta Stage Accuracy:
0.00001 Degree
Type:
Automatic
Vacuum:
-70 to 90 Kpa
Wafer Size:
6 Inches, 8 Inches
XY Moving Speed:
200 mm/sec
Z Repeatability:
1 µm
Z Resolution:
0.1 µm
Z Travel Area:
0 to 80 mm
more info
Chuck Size:
170 x 180 mm
Die Size:
300 to 100000 µm
Net Weight:
2000 kg
Overall Dimensions:
1600 x 1660 x 1450 mm
Power Supply:
AC 220V, 50/60 Hz
Repeatability:
1 µm
Resolution:
0.1 µm
Theta Movement:
10 Degree
Theta Stage Accuracy:
0.00001 Degree
Type:
Automatic
Vacuum:
-70 to 90 Kpa
Wafer Size:
8 Inches, 12 Inches
XY Moving Speed:
240 mm/sec
Z Repeatability:
1 µm
Z Resolution:
0.1 µm
Z Travel Area:
0 to 80 mm
more info
Accuracy:
1.8 µm
Probing Force:
200 kg, 300 kg
Stage Types:
Linear Motor
Type:
Automatic
Wafer Size:
200 mm, 300 mm
Z Accuracy:
5 µm
more info
Accuracy:
2 µm
Probing Force:
60 kg
Stage Types:
Ball Screw
Type:
Automatic
Wafer Size:
150 mm, 200 mm
Z Accuracy:
5 µm
more info
Accuracy:
1.8 µm, 2 µm
Probing Force:
100 kg, 200 kg
Stage Types:
Ball Screw
Type:
Automatic
Wafer Size:
200 mm, 300 mm
Z Accuracy:
5 µm
more info

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