Wafer Probe System - Page 2

124 Wafer Probe System from 18 Manufacturers meet your specification.
Accuracy:
5 µm
Chuck Size:
220 x 400 mm
Net Weight:
400 kg
Operating Temperature:
-60 to 350 Degree C
Overall Dimensions:
460 x 1000 x 1020 mm
Power Supply:
20kV DC/200A
Resolution:
0.1 µm
Theta Movement:
5 Degree
Theta Stage Resolution:
0.001 Degree
Type:
Semi Automatic
Wafer Size:
8 Inches
XY Moving Speed:
30 mm/sec
Z Repeatability:
2 µm
Z Travel Area:
30 mm
more info
Accuracy:
10 µm
Chuck Size:
320 x 500 mm
Net Weight:
800 kg
Operating Temperature:
-60 to 350 Degree C
Overall Dimensions:
880 x 1260 x 1030 mm
Power Supply:
20kV DC/200A
Resolution:
0.1 µm
Theta Movement:
6 Degree
Theta Stage Resolution:
0.000022294 Degree
Type:
Semi Automatic
Wafer Size:
12 Inches
XY Moving Speed:
25 mm/sec
Z Repeatability:
3 µm
Z Travel Area:
80 mm
more info
Chuck Size:
160 mm
Resolution:
1 µm
Theta Movement:
8 Degree
Type:
Automatic
Wafer Loading:
FOUP or Magazine Wafer Loading
Wafer Size:
150 mm, 200 mm, 300 mm
Wiring Capacity:
Up to 768 single DC lines, Up to 48 RF lines
XY Moving Speed:
Up to 35 mm/sec
Z Resolution:
1 µm
Z Travel Area:
0 to 40 mm
more info
Die Size:
6 to 120 mil
Net Weight:
750 kg
Operating Temperature:
0 to 100 Degree C
Overall Dimensions:
1160 x 1240 x 1500 mm
Pad Size:
50 µm
Power Supply:
Single phase, 220VAC ±10%, 50/60Hz, 20A
Type:
Automatic
Vacuum:
-2 bar
Wafer Size:
2 Inches, 4 Inches, 6 Inches, 8 Inches
Wavelength Repeatability:
0.3 nm
more info
Magnification:
2X, 5X, 10X
Net Weight:
3000 kg
Operating Temperature:
+5 Degree C to 40 Degree C
Overall Dimensions:
1900 x 1600 x 2000 mm
Power Supply:
AC 220V±10%, 50/60 Hz, 1F, 4.4 KW
Resolution:
1.28 µm, 0.5 µm, 0.25 µm
Type:
Automatic
Wafer Size:
8 Inches
more info
Accuracy:
= 2 µm
Chuck Size:
300 mm
Net Weight:
47 kg
Operating Temperature:
-60 to 300 Degree C
Overall Dimensions:
1058 x 866 x 25 mm
Planarity:
± 5 µm
Repeatability:
< 1 µm
Resolution:
0.2 µm
Theta Movement:
3.75 Degree
Theta Stage Accuracy:
= 2 µm
Theta Stage Repeatabilty:
< 1 µm
Theta Stage Resolution:
0.2 µm
Type:
Semi Automatic, Fully Automatic
Wafer Size:
300 mm
XY Moving Speed:
50 mm/s
Z Accuracy:
= 2 µm
Z Repeatability:
< 1 µm
Z Resolution:
0.2 µm
Z Travel Area:
10 mm
more info
Accuracy:
= 2 µm, = 0.3 µm
Chuck Flatness:
= ± 10 µm
Net Weight:
47 kg
Operating Temperature:
-60 to 300 Degree C
Overall Dimensions:
1058 x 866 x 25 mm
Planarity:
= 10 µm
Repeatability:
< 1 µm
Resolution:
0.2 µm
Theta Movement:
3.75 Degree
Theta Stage Accuracy:
= 2 µm, = 5 µm
Theta Stage Repeatabilty:
< 1 µm
Theta Stage Resolution:
0.2 µm
Type:
Semi Automatic, Fully Automatic
Wafer Size:
200 mm, 300 mm
XY Moving Speed:
50 mm/s
Z Accuracy:
= 2 µm
Z Repeatability:
< 1 µm
Z Resolution:
0.2 µm
Z Travel Area:
10 mm
more info
Accuracy:
= 2 µm, = 0.3 µm
Chuck Flatness:
= ± 10 µm
Net Weight:
47 kg
Operating Temperature:
-60 to 300 Degree C
Overall Dimensions:
1058 x 866 x 25 mm
Planarity:
= 10 µm
Repeatability:
< 1 µm
Resolution:
0.2 µm
Theta Movement:
3.75 Degree
Theta Stage Accuracy:
= 2 µm, = 5 µm
Theta Stage Repeatabilty:
< 1 µm
Theta Stage Resolution:
0.2 µm
Type:
Semi Automatic, Fully Automatic
Wafer Size:
300 mm
XY Moving Speed:
50 mm/s
Z Accuracy:
= 2 µm
Z Repeatability:
< 1 µm
Z Resolution:
0.2 µm
Z Travel Area:
10 mm
more info
Chuck Size:
155 x 155 mm
Operating Temperature:
30 to 300 Degree C
Planarity:
3 µm
Platen Travel Size:
40 mm
Resolution:
5 µm
Theta Movement:
8 Degree
Theta Stage Resolution:
7.5 x 10-3 gradient
Type:
Manual
Wafer Size:
150 mm
more info
Chuck Size:
155 x 155 mm
Planarity:
10 µm
Repeatability:
< 1 µm
Resolution:
5 µm
Stage Travel Range Fine:
50 x 50 mm, 150 x 100 mm
Theta Movement:
8 Degree
Theta Stage Resolution:
7.5 x 10-3 gradient
Type:
Manual
Z Travel Area:
12.5 mm
more info

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