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Wire Bonders - Page 3

80 Wire Bonders from 17 Manufacturers meet your specification.
ROCKET LED Image
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Guangdong ADA Semiconductor Equipment - ROCKET LED

Wire Bonder from Guangdong ADA Semiconductor Equipment
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Bond Speed:
40 ms/wire
Bonding Method:
Wire Bonder, Ball Bonder
Leadframe Dimensions:
83 mm
Placement Accuracy:
±3 µm
more info
ROCKET 100 Image
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Guangdong ADA Semiconductor Equipment - ROCKET 100

Wire Bonder from Guangdong ADA Semiconductor Equipment
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Bond Speed:
40 ms/wire
Bonding Method:
Wire Bonder, Ball Bonder
Leadframe Dimensions:
100 mm
Placement Accuracy:
±2 µm
more info
MDB-2575 Image
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Guangzhou Minder-Hightech Co.,Ltd - MDB-2575

Wire Bonder from Guangzhou Minder-Hightech Co.,Ltd
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Bonding Area:
16 mm dia
Bonding Method:
Wire bonder
Net Weight:
36 kg
Bond Froce:
10 to 60 g
Overall Dimensions:
600 x 560 x 390 mm
Power Supply:
220 VAC ± 10%, 50Hz
Bond Time:
5 to 200 ms
Copper Wire Size:
25 to 75 µm
Ultrasonic Power:
0 to 3 W, 60 kHz
more info
MDBB-1750 Image
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Guangzhou Minder-Hightech Co.,Ltd - MDBB-1750

Wire Bonder from Guangzhou Minder-Hightech Co.,Ltd
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Bonding Area:
25 mm dia
Bonding Method:
Wire bonder
Net Weight:
28 kg
Bond Froce:
35 to 180 g
Overall Dimensions:
700 x 460 x 550 mm
Power Supply:
220 VAC ± 10%, 50Hz
Bond Time:
5 to 200 ms
Bonding Wire Length:
0 to 2 mm
Copper Wire Size:
17 to 50 µm
Temperature Control:
400 Degree C
Ultrasonic Power:
0 to 3 W
more info
MDB-7550 Image
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Guangzhou Minder-Hightech Co.,Ltd - MDB-7550

Wire Bonder from Guangzhou Minder-Hightech Co.,Ltd
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Bonding Area:
25 mm dia
Bonding Method:
Wire bonder
Net Weight:
40 kg
Bond Froce:
30 to 1200 g
Overall Dimensions:
620 x 610 x 560 mm
Power Supply:
220 VAC ± 10%, 50Hz
Bond Time:
10 to 500 ms
Copper Wire Size:
75 to 500 µm
Motorized X and Y Travel:
0 to 18 mm
Ultrasonic Power:
0 to 30 W
more info
MDHX-M6000 Image
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Guangzhou Minder-Hightech Co.,Ltd - MDHX-M6000

Wire Bonder from Guangzhou Minder-Hightech Co.,Ltd
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Bonding Method:
Wire Bonder, Ball Bonder, Wedge Bonder
Net Weight:
46 kg
Aluminium Wire Size:
15 to 100 µm
Bond Froce:
1 to 250 g
Overall Dimensions:
603 x 596 x 319 mm
Power Supply:
220 VAC ± 10% 500 W, 50/60 Hz
Copper Wire Size:
18 to 25 µm
Gold Wire Size:
15 to 100 µm
Motorized X and Y Travel:
270 x 265 mm
Standard Working Height:
20 mm
Ultrasonic Power:
0 to 10 W
Wire Feed Angle:
90 Degree, 45 Degree
Wire Spool Size:
50 x 12.5 µm to 300 x 25.4 µm
more info
MDAWB-3030S Image
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Guangzhou Minder-Hightech Co.,Ltd - MDAWB-3030S

Wire Bonder from Guangzhou Minder-Hightech Co.,Ltd
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Bond Speed:
2 s/wire
Bonding Method:
Wire bonder
Net Weight:
450 kg
Aluminium Wire Size:
125 to 500 µm
Bond Froce:
50 to 1200 g
Overall Dimensions:
810 x 620 x 1558 mm
Power Supply:
220 V, 50 Hz, 800 W
Bond Time:
10 to 500 ms
Motorized X and Y Travel:
300 x 300 mm
Motorized Z Travel:
50 mm
Placement Accuracy:
0.02 mm
Ultrasonic Frequency:
60 kHz
Ultrasonic Power:
0 to 30 W
Wire Feed Angle:
90 Degree
more info
MDAWB-4T400 Image
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Guangzhou Minder-Hightech Co.,Ltd - MDAWB-4T400

Wire Bonder from Guangzhou Minder-Hightech Co.,Ltd
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Bond Speed:
2 s/wire
Bonding Method:
Wire bonder
Net Weight:
800 kg
Aluminium Wire Size:
125 to 500 µm
Bond Froce:
50 to 1200 g
Overall Dimensions:
1500 x 1800 x 1650 mm
Power Supply:
220 V, 50 Hz, 800 W
Bond Time:
10 to 500 ms
Motorized X and Y Travel:
400 x 400 mm
Motorized Z Travel:
50 mm
Placement Accuracy:
0.02 mm
Ultrasonic Frequency:
60 kHz
Ultrasonic Power:
0 to 30 W
Wire Feed Angle:
90 Degree
more info
MDAWB-4NL400 Image
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Guangzhou Minder-Hightech Co.,Ltd - MDAWB-4NL400

Wire Bonder from Guangzhou Minder-Hightech Co.,Ltd
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Bond Speed:
2 s/wire
Bonding Method:
Wire bonder
Net Weight:
1220 kg
Aluminium Wire Size:
125 to 500 µm
Bond Froce:
50 to 1200 g
Overall Dimensions:
1500 x 2200 x 1900 mm
Power Supply:
220 V, 50 Hz, 800 W
Bond Time:
10 to 500 ms
Motorized X and Y Travel:
400 x 800 mm
Motorized Z Travel:
50 mm
Placement Accuracy:
0.02 mm
Ultrasonic Frequency:
60 kHz
Ultrasonic Power:
0 to 30 W
Wire Feed Angle:
90 Degree
more info
MDB-7550B Image
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Guangzhou Minder-Hightech Co.,Ltd - MDB-7550B

Wire Bonder from Guangzhou Minder-Hightech Co.,Ltd
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Bonding Area:
25 mm dia
Bonding Method:
Wire bonder
Net Weight:
40 kg
Aluminium Wire Size:
75 to 500 µm
Bond Froce:
30 to 1200 g
Overall Dimensions:
620 x 610 x 560 mm
Power Supply:
220 VAC ± 10%, 50 Hz
Bond Time:
10 to 500 ms
Motorized X and Y Travel:
0 to 18 mm
Ultrasonic Power:
0 to 30 W
more info
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