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Wire Bonders - Page 2

80 Wire Bonders from 17 Manufacturers meet your specification.
5632i Image
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F&S Bondtec Semiconductor GmbH - 5632i

Wire Bonder from F&S Bondtec Semiconductor GmbH
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Bond Speed:
1 Wire in 2 to 3 sec
Bonding Area:
100 x 100 mm
Bonding Method:
Wedge Bonder
Net Weight:
75 kg
Aluminium Wire Size:
12.5 of 75 µm
Overall Dimensions:
700 x 650 x 700 mm
Power Supply:
100-240 VAC, 1 Phase, 50/60 Hz, max 500 VA
Gold Wire Size:
12.5 of 75 µm
Loop Height Accuracy:
5 µm
Placement Accuracy:
5 µm
Programmable Linear Z axis:
60 mm
Repeatability:
3 µm
Ribbon Size:
30 x 12.5 µm to 250 x 25 µm
Step Resolution:
1 µm
Temperature Control:
0 to 250 Degree C
Ultrasonic Frequency:
100 kHz
Wire Spool Size:
2 Inches
more info
5650i Image
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F&S Bondtec Semiconductor GmbH - 5650i

Wire Bonder from F&S Bondtec Semiconductor GmbH
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Bond Speed:
1 Wire in 2 to 3 sec
Bonding Area:
100 x 100 mm
Bonding Method:
Wedge Bonder
Net Weight:
75 kg
Aluminium Wire Size:
100 of 500 µm
Bond Froce:
Up to 1800 cN
Overall Dimensions:
700 x 650 x 700 mm
Power Supply:
100-240 VAC, 1 Phase, 50/60 Hz, max 500 VA
Bondheads:
90 mm
Copper Wire Size:
100 of 300 µm
Loop Height Accuracy:
5 µm
Placement Accuracy:
5 µm
Programmable Linear Z axis:
60 mm
Repeatability:
3 µm
Step Resolution:
1 µm
Temperature Control:
0 to 250 Degree C
Ultrasonic Frequency:
58 kHz
Wire Spool Size:
4 Inches
more info
5650HRi Image
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F&S Bondtec Semiconductor GmbH - 5650HRi

Wire Bonder from F&S Bondtec Semiconductor GmbH
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Bond Speed:
1 Wire in 3 sec
Bonding Area:
100 x 100 mm
Bonding Method:
Wedge Bonder
Net Weight:
75 kg
Bond Froce:
Up to 1800 cN
Overall Dimensions:
700 x 650 x 700 mm
Power Supply:
100-240 VAC, 1 Phase, 50/60 Hz, max 500 VA
Bondheads:
90 mm
Copper Wire Size:
300 to 500 µm
Loop Height Accuracy:
5 µm
Placement Accuracy:
5 µm
Programmable Linear Z axis:
60 mm
Repeatability:
3 µm
Ribbon Size:
2000 x 300 µm
Step Resolution:
1 µm
Temperature Control:
0 to 250 Degree C
Ultrasonic Frequency:
60 kHz
Wire Spool Size:
4 Inches
more info
5810 Image
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F&S Bondtec Semiconductor GmbH - 5810

Wire Bonder from F&S Bondtec Semiconductor GmbH
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Bond Speed:
1 Wire in sec
Bonding Area:
200 x 150 mm
Bonding Method:
Ball Bonder, Wedge Bonder
Net Weight:
80 kg
Overall Dimensions:
920 x 710 x 650 mm
Power Supply:
100-240 VAC, 1 Phase, 50/60 Hz, max 230 VA
Bondheads:
16 mm
Gold Wire Size:
12.5 to 50 µm
Loop Height Accuracy:
5 µm
Placement Accuracy:
5 µm
Programmable Linear Z axis:
100 mm
Repeatability:
3 µm
Step Resolution:
1 µm
Temperature Control:
0 to 250 Degree C
Ultrasonic Frequency:
67 kHz
Wire Spool Size:
2 Inches
more info
5830 Image
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F&S Bondtec Semiconductor GmbH - 5830

Wire Bonder from F&S Bondtec Semiconductor GmbH
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Bond Speed:
1 Wire in sec
Bonding Area:
200 x 150 mm
Bonding Method:
Wedge Bonder
Net Weight:
80 kg
Aluminium Wire Size:
17.5 to 75 µm
Overall Dimensions:
920 x 710 x 650 mm
Power Supply:
100-240 VAC, 1 Phase, 50/60 Hz, max 230 VA
Gold Wire Size:
17.5 to 75 µm
Loop Height Accuracy:
5 µm
Placement Accuracy:
5 µm
Programmable Linear Z axis:
100 mm
Repeatability:
3 µm
Step Resolution:
1 µm
Temperature Control:
0 to 250 Degree C
Ultrasonic Frequency:
100 kHz
Wire Feed Angle:
45 Degree
Wire Spool Size:
2 Inches
more info
5832 Image
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F&S Bondtec Semiconductor GmbH - 5832

Wire Bonder from F&S Bondtec Semiconductor GmbH
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Bond Speed:
1 Wire in sec
Bonding Area:
200 x 150 mm
Bonding Method:
Wedge Bonder
Net Weight:
80 kg
Aluminium Wire Size:
17.5 to 75 µm
Overall Dimensions:
920 x 710 x 650 mm
Power Supply:
100-240 VAC, 1 Phase, 50/60 Hz, max 230 VA
Gold Wire Size:
17.5 to 75 µm
Loop Height Accuracy:
5 µm
Placement Accuracy:
5 µm
Programmable Linear Z axis:
100 mm
Repeatability:
3 µm
Ribbon Size:
30 x 12.5 µm to 250 x 25 µm
Step Resolution:
1 µm
Temperature Control:
0 to 250 Degree C
Ultrasonic Frequency:
100 kHz
Wire Spool Size:
2 Inches
more info
5850 Image
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F&S Bondtec Semiconductor GmbH - 5850

Wire Bonder from F&S Bondtec Semiconductor GmbH
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Bond Speed:
1 Wire in sec
Bonding Area:
200 x 150 mm
Bonding Method:
Wedge Bonder
Net Weight:
80 kg
Aluminium Wire Size:
100 to 500 µm
Bond Froce:
Up to 1800 cN
Overall Dimensions:
920 x 710 x 650 mm
Power Supply:
100-240 VAC, 1 Phase, 50/60 Hz, max 230 VA
Copper Wire Size:
100 to 300 µm
Programmable Linear Z axis:
100 mm
Step Resolution:
1 µm
Temperature Control:
0 to 250 Degree C
Ultrasonic Frequency:
60 kHz
Wire Spool Size:
4 Inches
more info
5850HR Image
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F&S Bondtec Semiconductor GmbH - 5850HR

Wire Bonder from F&S Bondtec Semiconductor GmbH
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Bond Speed:
1 Wire in sec
Bonding Area:
200 x 150 mm
Bonding Method:
Wedge Bonder
Net Weight:
80 kg
Bond Froce:
Up to 1800 cN
Overall Dimensions:
920 x 710 x 650 mm
Power Supply:
100-240 VAC, 1 Phase, 50/60 Hz, max 230 VA
Copper Wire Size:
300 to 500 µm
Programmable Linear Z axis:
100 mm
Ribbon Size:
Up to 2000 x 300 µm
Step Resolution:
1 µm
Temperature Control:
0 to 250 Degree C
Ultrasonic Frequency:
60 kHz
Wire Spool Size:
4 Inches
more info
8650 Image
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F&S Bondtec Semiconductor GmbH - 8650

Wire Bonder from F&S Bondtec Semiconductor GmbH
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Bond Speed:
0.2 to 16 mm/sec
Bonding Method:
Wedge Bonder
Net Weight:
600 kg
Aluminium Wire Size:
100 to 500 µm
Bond Froce:
Up to 1800 cN
Overall Dimensions:
2000 x 1300 x 1000 mm
Power Supply:
230 VAC
Bondheads:
90 mm
Copper Wire Size:
100 to 300 µm
Motorized X and Y Travel:
700 mm, 480 mm
Motorized Z Travel:
100 mm
Repeatability:
5 µm
Step Resolution:
1 µm
Ultrasonic Frequency:
60 kHz
Wire Spool Size:
4 Inches
more info
ROCKET IC Image
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Guangdong ADA Semiconductor Equipment - ROCKET IC

Wire Bonder from Guangdong ADA Semiconductor Equipment
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Bond Speed:
40 ms/wire
Bonding Method:
Wire Bonder, Ball Bonder
Leadframe Dimensions:
83 mm
Placement Accuracy:
±2 µm
more info
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