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Wire Bonders - Page 8

80 Wire Bonders from 17 Manufacturers meet your specification.
UTC-5000Super Image
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Yamaha Motor Corporation - UTC-5000Super

Wire Bonder from Yamaha Motor Corporation
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Bond Speed:
45 ms/2 mm
Bonding Area:
28 x 43.5 mm
Bonding Method:
Wedge Bonder
Net Weight:
520 kg
Aluminium Wire Size:
15 to 50 µm
Bond Froce:
3 to 1000 gf
Overall Dimensions:
1244 x 964 x 2092 mm
Power Supply:
Single Phase 100 VAC, 50/60 Hz, 1.3 kVA
Bonding Wire Length:
8 mm max
No of Bonding Wires:
30000 wires max
Placement Accuracy:
2 µm
Step Resolution:
0.1 µm
Workpiece Size:
300 x 95 mm
more info
UTC-5000NeoCu Super Image
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Yamaha Motor Corporation - UTC-5000NeoCu Super

Wire Bonder from Yamaha Motor Corporation
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Bond Speed:
45 ms/2 mm
Bonding Area:
28 x 43.5 mm
Bonding Method:
Wedge Bonder
Net Weight:
520 kg
Aluminium Wire Size:
15 to 50 µm
Bond Froce:
3 to 1000 gf
Overall Dimensions:
1244 x 964 x 2092 mm
Power Supply:
Single Phase 100 VAC, 50/60 Hz, 1.3 kVA
Bonding Wire Length:
8 mm max
Copper Wire Size:
15 to 50 µm
No of Bonding Wires:
30000 wires max
Placement Accuracy:
2 µm
Step Resolution:
0.1 µm
Workpiece Size:
300 x 95 mm
more info
UTC-5000WE NeoCu Super Image
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Yamaha Motor Corporation - UTC-5000WE NeoCu Super

Wire Bonder from Yamaha Motor Corporation
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Bond Speed:
45 ms/2 mm
Bonding Area:
28 x 46 mm
Bonding Method:
Wedge Bonder
Net Weight:
520 kg
Aluminium Wire Size:
18 to 65 µm
Bond Froce:
3 to 1000 gf
Overall Dimensions:
1244 x 964 x 2092 mm
Power Supply:
Single Phase 100 VAC, 50/60 Hz, 1.3 kVA
Bonding Wire Length:
8 mm max
Copper Wire Size:
18 to 65 µm
No of Bonding Wires:
30000 wires max
Placement Accuracy:
2 µm
Step Resolution:
0.1 µm
Workpiece Size:
300 x 100 mm
more info
UTC-5100 Image
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Yamaha Motor Corporation - UTC-5100

Wire Bonder from Yamaha Motor Corporation
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Bond Speed:
42 ms/0.7 mm wire (45 ms/2 mm wire)
Bonding Area:
66 x 95 mm
Bonding Method:
Wedge Bonder
Net Weight:
520 kg
Aluminium Wire Size:
18 to 50 µm
Bond Froce:
3 to 1000 gf
Overall Dimensions:
1244 x 964 x 2092 mm
Power Supply:
Single Phase 100 VAC, 50/60 Hz, 1.2 kVA
Bonding Wire Length:
4 mm max
No of Bonding Wires:
12000 wires max
Placement Accuracy:
3 µm
Step Resolution:
0.1 µm
Workpiece Size:
300 x 102 mm
more info
HW582 Image
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HIGHLYWIN - HW582

Wire Bonder from HIGHLYWIN
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Bonding Area:
56 x 75 mm
Bonding Method:
Wire Bonder
Bond Time:
40 ms/wire
Copper Wire Size:
15 to 50 µm
Magazine Dimensions:
275 x 78 mm
Placement Accuracy:
±2 µm
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HW-BA60 Image
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HIGHLYWIN - HW-BA60

Wire Bonder from HIGHLYWIN
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Bond Speed:
9000 uph/h
Bonding Area:
80 x 80 mm
Bonding Method:
Wire Bonder
Aluminium Wire Size:
500 x 100 µm to 2000 x 250 µm
Number of Heads:
2 Heads
Bond Froce:
50 to 1500 g
Leadframe Dimensions:
260 x 80 mm
Motorized Z Travel:
50 mm
Repeatability:
±3 µm
Step Resolution:
0.5 µm
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HW585 Image
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HIGHLYWIN - HW585

Wire Bonder from HIGHLYWIN
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Bonding Area:
56 x 90 mm
Bonding Method:
Wire Bonder
Bond Time:
40 ms/wire
Copper Wire Size:
15 to 50 µm
Magazine Dimensions:
300 x 100 mm
Placement Accuracy:
±2 µm
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Gold Wire Bonding Machine Image
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Guangdong Xiaowei Intelligent Technology Co., Ltd - Gold Wire Bonding Machine

Wire Bonder from Guangdong Xiaowei Intelligent Technology Co., Ltd
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Bonding Method:
Wire bonder
Net Weight:
28 kg
Bond Froce:
25 to 180 g
Overall Dimensions:
520 x 460 x 550 mm
Power Supply:
AC110V 220VAC±10% 50Hz, 300W
Bond Time:
5 to 200 ms
Gold Wire Size:
16 to 50 µm
Temperature Control:
Room Temp to 400 Degree C
Ultrasonic Power:
0 to 5 W
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Ultrasonic Wire Bonding Machine Image
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Guangdong Xiaowei Intelligent Technology Co., Ltd - Ultrasonic Wire Bonding Machine

Wire Bonder from Guangdong Xiaowei Intelligent Technology Co., Ltd
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Bonding Area:
160 mm
Bonding Method:
Wire bonder
Net Weight:
36 kg
Aluminium Wire Size:
18 to 50 µm
Bond Froce:
10 to 60 g
Overall Dimensions:
600 x 560 x 390 mm
Power Supply:
AC 220V±10% (50Hz), 60W
Bond Time:
5 to 200 ms
Ultrasonic Frequency:
61 KHz±1 KHz
Ultrasonic Power:
0 to 5 W
Wire Feed Angle:
45 Degree
more info
GR-W02 Image
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Green Intelligent Equipment(Shenzhen) Co., Ltd - GR-W02

Wire Bonder from Green Intelligent Equipment(Shenzhen) Co., Ltd
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Air Pressure:
0.5 to 0.7 MPa
Bonding Method:
Wire Bonder, Wedge Bonder
Net Weight:
1200 kg
Bond Froce:
50 to 1000 g
Overall Dimensions:
1820 x 1260 x 1700 mm
Power Supply:
180-240V AC single phase, 50/60HZ, 4.0kVA
Copper Wire Size:
127 to 508 µm
Motorized X and Y Travel:
100 x 100 mm
Motorized Z Travel:
50 mm
Placement Accuracy:
0.1 µm
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