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Wire Bonders - Page 5

80 Wire Bonders from 17 Manufacturers meet your specification.
572A Image
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HYBOND, Inc - 572A

Wire Bonder from HYBOND, Inc
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Bonding Method:
Wedge Bonder
Net Weight:
24.9 kg
Bond Froce:
15 to 150 g
Power Supply:
120 VAC 50/60 Hz @ 10A
Bond Time:
10 to 400 ms
Gold Wire Size:
12.7 to 50 µm
Motorized X and Y Travel:
152.4 x 215.9 mm
Motorized Z Travel:
12.7 mm
Ribbon Size:
25.4 x 254 µm
Temperature Control:
Ambient to 250 Degree C
Ultrasonic Frequency:
62.5 kHz
Ultrasonic Power:
0 to 1 W to 0 to 2 W
Wire Spool Size:
0.5 Inches, 2 Inches
more info
572A-40 Image
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HYBOND, Inc - 572A-40

Wire Bonder from HYBOND, Inc
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Bonding Method:
Wedge Bonder
Net Weight:
31.8 kg
Bond Froce:
15 to 120 g
Power Supply:
120 VAC 50/60 Hz @ 10A
Bond Time:
10 to 400 ms
Gold Wire Size:
12.7 to 50 µm
Motorized X and Y Travel:
250 x 300 mm
Motorized Z Travel:
12.7 mm
Ribbon Size:
25.4 x 254 µm
Temperature Control:
Ambient to 250 Degree C
Ultrasonic Frequency:
62.5 kHz
Ultrasonic Power:
0 to 1 W to 0 to 2 W
Wire Spool Size:
0.5 Inches, 2 Inches
more info
Thermosonic Ball Bonder (Au, Cu, Ag) Image
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Iwatani Corporation - Thermosonic Ball Bonder (Au, Cu, Ag)

Wire Bonder from Iwatani Corporation
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Bonding Area:
56 x 80 mm
Bonding Method:
Ball Bonder
Net Weight:
550 kg
Aluminium Wire Size:
12 to 75 µm
Overall Dimensions:
1200 x 1085 x 1728 mm
Bond Time:
43 ms/wire
Leadframe Dimensions:
295 x 90 mm
Magazine Dimensions:
305 x 110 x 175 mm
Placement Accuracy:
±2.5 µm
more info
Thermosonic Ball Bonder Image
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Iwatani Corporation - Thermosonic Ball Bonder

Wire Bonder from Iwatani Corporation
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Bonding Area:
56 x 95 mm
Bonding Method:
Ball Bonder
Net Weight:
550 kg
Aluminium Wire Size:
12 to 75 µm
Overall Dimensions:
1200 x 1085 x 1728 mm
Bond Time:
50 ms/wire
Leadframe Dimensions:
300 x 105 mm
Magazine Dimensions:
115 x 305 x 175 mm
Placement Accuracy:
±3 µm
more info
FB-i28 Image
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Kaijo Corporation - FB-i28

Wire Bonder from Kaijo Corporation
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Bonding Area:
56 x 88 mm
Bonding Method:
Ball Bonder
Net Weight:
550 kg
Overall Dimensions:
1065 x 1175 x 1725 mm
Bond Time:
45 ms/wire
Magazine Dimensions:
115 x 305 x 175 mm
Placement Accuracy:
? 2.0 µm
Workpiece Size:
100 x 300 mm
more info
FB-e20N Image
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Kaijo Corporation - FB-e20N

Wire Bonder from Kaijo Corporation
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Bonding Area:
56 x 80 mm
Bonding Method:
Ball Bonder
Net Weight:
560 kg
Overall Dimensions:
1065 x 1186 x 1727 mm
Bond Time:
43 ms/wire
Magazine Dimensions:
110 x 310 x 175 mm
Placement Accuracy:
? 2.0 µm
more info
POWERCOMM Image
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Kulicke and Soffa Industries, Inc - POWERCOMM

Wire Bonder from Kulicke and Soffa Industries, Inc
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Air Consumption:
75 L/min
Bonding Area:
56 x 87 mm
Air Pressure:
3.52 kg/sq cm
Bonding Method:
Wire Bonder
Net Weight:
556 kg
Overall Dimensions:
Base Machine with MHS x 556 x 670 mm
Power Supply:
200-240 VAC, -15% to 10%, Single Phase, 50/60 Hz, 1.3 KVA
Bonding Wire Length:
7.6 mm
Die Pad Downset:
Up to 2.3 mm
Different Leadframe Type:
8 min
Gold Wire Size:
25.4 µm
Leadframe Dimensions:
300 x 95 mm
Magazine Dimensions:
305 x 98 x 178 mm
Minimum Loop Height:
100 µm, 70 µm, 50 µm
Placement Accuracy:
3 µm
Same Leadframe Type:
4 min
Wire Pitch:
1.27 to 25 mm
Wire Sway:
25 µm
more info
POWERNEXX Image
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Kulicke and Soffa Industries, Inc - POWERNEXX

Wire Bonder from Kulicke and Soffa Industries, Inc
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Air Consumption:
80 lpm
Bonding Area:
56 x 80 mm
Air Pressure:
3.52 kg/sq cm
Bonding Method:
Wire Bonder
Net Weight:
556 kg
Overall Dimensions:
Base Machine with MHS x 880 x 970 mm
Power Supply:
200-240 VAC, -15% to 10%, Single Phase, 50/60 Hz, 1.3 KVA
Bonding Wire Length:
7.6 mm
Die Pad Downset:
Up to 2.3 mm
Different Leadframe Type:
8 min
Gold Wire Size:
25.4 µm
Leadframe Dimensions:
300 x 92 mm
Magazine Dimensions:
310 x 100 x 178 mm
Minimum Loop Height:
100 µm, 70 µm, 50 µm
Placement Accuracy:
2.5 µm
Same Leadframe Type:
4 min
Wire Pitch:
1.27 to 25 mm
Wire Sway:
25 µm
more info
ULTRALUX Image
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Kulicke and Soffa Industries, Inc - ULTRALUX

Wire Bonder from Kulicke and Soffa Industries, Inc
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Air Consumption:
150 L/min
Bond Speed:
25 wire per sec
Bonding Area:
56 x 80 mm
Air Pressure:
3.52 kg/sq cm
Bonding Method:
Ball Bonder
Net Weight:
556 kg
Overall Dimensions:
Base Machine with MHS x 889 x 990 mm
Power Supply:
200-240 VAC, -15% to 10%, Single Phase, 50/60 Hz, 2 KVA
Bonding Wire Length:
5 mm
Die Pad Downset:
Up to 2.3 mm
Different Leadframe Type:
20 min
Gold Wire Size:
25.4 µm
Leadframe Dimensions:
300 x 90 mm
Magazine Dimensions:
310 x 98 x 194 mm
Minimum Loop Height:
65 µm
Placement Accuracy:
3 µm
Same Leadframe Type:
5 min
Wire Sway:
25 µm
more info
RAPID PRO Image
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Kulicke and Soffa Industries, Inc - RAPID PRO

Wire Bonder from Kulicke and Soffa Industries, Inc
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Air Consumption:
185 L/min
Bonding Area:
56 x 80 mm
Air Pressure:
3.52 kg/sq cm
Bonding Method:
Ball Bonder
Net Weight:
590 kg
Overall Dimensions:
Base Machine with MHS x 889 x 1003 mm
Power Supply:
200-240 VAC, -15% to 10%, Single Phase, 50/60 Hz, 2.6 KVA
Bonding Wire Length:
7.6 mm
Die Pad Downset:
Up to 2.3 mm
Different Leadframe Type:
8 min
Gold Wire Size:
0.6 to 2.5 mil
Leadframe Dimensions:
300 x 92 mm
Magazine Dimensions:
305 x 110 x 178 mm
Minimum Loop Height:
40 µm
Placement Accuracy:
2 µm
Same Leadframe Type:
4 min
Wire Pitch:
35 µm
Wire Sway:
25 µm
more info
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