1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Wire Bonders
Filters

Wire Bonders - Page 4

80 Wire Bonders from 17 Manufacturers meet your specification.
Bondjet BJ955 Image
 Download Datasheet  Request Information  Product Details

Hesse GmbH - Bondjet BJ955

Wire Bonder from Hesse GmbH
 Download Datasheet  Request Information
Bonding Method:
Wedge Bonder
Net Weight:
1150 kg
Overall Dimensions:
740 x 1484 x 1912 mm
Power Supply:
230V AC
Copper Wire Size:
50 to 600 µm
Motorized X and Y Travel:
305 x 410 mm
Motorized Z Travel:
42 mm
Ribbon Size:
250 x 25 µm up to 2000 x 400 µm
more info
Bondjet BJ959 Image
 Download Datasheet  Request Information  Product Details

Hesse GmbH - Bondjet BJ959

Wire Bonder from Hesse GmbH
 Download Datasheet  Request Information
Bonding Method:
Wedge Bonder
Net Weight:
1300 kg
Overall Dimensions:
805 x 1634 x 1912 mm
Power Supply:
230V AC
Copper Wire Size:
50 to 600 µm
Motorized X and Y Travel:
370 x 560 mm
Motorized Z Travel:
42 mm
Ribbon Size:
250 x 25 µm up to 2000 x 400 µm
more info
Bondjet BJ985 Image
 Download Datasheet  Request Information  Product Details

Hesse GmbH - Bondjet BJ985

Wire Bonder from Hesse GmbH
 Download Datasheet  Request Information
Bonding Method:
Wedge Bonder
Net Weight:
1800 kg
Overall Dimensions:
880 x 1780 x 1912 mm
Power Supply:
230V AC
Copper Wire Size:
50 to 600 µm
Motorized X and Y Travel:
370 x 870 mm
Motorized Z Travel:
42 mm
Ribbon Size:
250 x 25 µm up to 2000 x 400 µm
more info
Bondjet BJ855 Image
 Download Datasheet  Request Information  Product Details

Hesse GmbH - Bondjet BJ855

Wire Bonder from Hesse GmbH
 Download Datasheet  Request Information
Bonding Method:
Ball Bonder, Wedge Bonder, Wire Bonder
Net Weight:
1150 kg
Overall Dimensions:
740 x 1484 x 1912 mm
Power Supply:
230V AC
Bond Time:
Up to 7 wire per sec
Copper Wire Size:
12.5 to 75 µm
Motorized X and Y Travel:
305 x 410 mm
Motorized Z Travel:
19 mm
Ribbon Size:
35 x 6 µm up to 250 x 25 µm
Wire Feed Angle:
45 Degree, 60 Degree, 90 Degree
Wire Pitch:
40 µm
more info
Bondjet BJ885 Image
 Download Datasheet  Request Information  Product Details

Hesse GmbH - Bondjet BJ885

Wire Bonder from Hesse GmbH
 Download Datasheet  Request Information
Bonding Method:
Ball Bonder, Wedge Bonder, Wire Bonder
Net Weight:
1800 kg
Overall Dimensions:
880 x 1780 x 1912 mm
Power Supply:
230V AC
Bond Time:
Up to 7 wire per sec
Copper Wire Size:
12.5 to 75 µm
Motorized X and Y Travel:
370 x 870 mm
Motorized Z Travel:
19 mm
Ribbon Size:
35 x 6 µm up to 250 x 25 µm
Wire Feed Angle:
45 Degree, 60 Degree, 90 Degree
Wire Pitch:
40 µm
more info
Bondjet BJ653 Image
 Download Datasheet  Request Information  Product Details

Hesse GmbH - Bondjet BJ653

Wire Bonder from Hesse GmbH
 Download Datasheet  Request Information
Bonding Method:
Wire Bonder
Net Weight:
330 kg
Overall Dimensions:
700 x 1020 x 1409 mm
Power Supply:
100-240 VAC
Bondheads:
45 to 90 Degree
Copper Wire Size:
50 to 600 µm
Motorized X and Y Travel:
100 x 115 mm
Motorized Z Travel:
42 mm
Ribbon Size:
250 x 25 µm up to 2000 x 400 µm
Ultrasonic Frequency:
120 to 60 kHz
Wire Pitch:
40 µm
more info
MODEL 626 Image
 Download Datasheet  Request Information  Product Details

HYBOND, Inc - MODEL 626

Wire Bonder from HYBOND, Inc
 Download Datasheet  Request Information
Bonding Method:
Ball Bonder, Wedge Bonder, Wire Bonder
Net Weight:
31.8 kg
Bond Froce:
12 to 250 g
Power Supply:
90-260 VAC 50/60 Hz @ 10A
Bond Time:
0 to 900 ms
Gold Wire Size:
12.7 to 76 µm
Motorized Z Travel:
19 mm
Ribbon Size:
25.4 x 510 µm
Temperature Control:
Ambient to 250 Degree C
Ultrasonic Frequency:
62.5 kHz
Ultrasonic Power:
0 to 0.2 W to, 0 to 2 W
more info
Model 676 Image
 Download Datasheet  Request Information  Product Details

HYBOND, Inc - Model 676

Wire Bonder from HYBOND, Inc
 Download Datasheet  Request Information
Bonding Method:
Wedge Bonder, Wire Bonder
Net Weight:
31.8 kg
Bond Froce:
12 to 250 g
Power Supply:
90-260 VAC 50/60 Hz @ 10A
Bond Time:
0 to 900 ms
Gold Wire Size:
12.7 to 76 µm
Motorized Z Travel:
19 mm
Ribbon Size:
25.4 x 510 µm
Temperature Control:
Ambient to 250 Degree C
Ultrasonic Frequency:
62.5 kHz
Ultrasonic Power:
0 to 0.2 W to, 0 to 2 W
more info
522A Image
 Download Datasheet  Request Information  Product Details

HYBOND, Inc - 522A

Wire Bonder from HYBOND, Inc
 Download Datasheet  Request Information
Bonding Method:
Ball Bonder
Net Weight:
24.9 kg
Bond Froce:
15 to 150 g
Power Supply:
120 VAC 50/60 Hz @ 10A
Bond Time:
10 to 400 ms
Gold Wire Size:
18 to 50 µm
Motorized X and Y Travel:
152 x 216 mm
Motorized Z Travel:
12.7 mm
Temperature Control:
Ambient to 250 Degree C
Ultrasonic Frequency:
62.5 kHz
Ultrasonic Power:
0 to 1 W to 0 to 2 W
Wire Spool Size:
0.5 Inches, 2 Inches
more info
522A-40 Image
 Download Datasheet  Request Information  Product Details

HYBOND, Inc - 522A-40

Wire Bonder from HYBOND, Inc
 Download Datasheet  Request Information
Bonding Method:
Ball Bonder
Net Weight:
31.8 kg
Bond Froce:
15 to 120 g
Power Supply:
120 VAC 50/60 Hz @ 10A
Bond Time:
10 to 400 ms
Gold Wire Size:
18 to 50 µm
Motorized X and Y Travel:
254 x 304 mm
Motorized Z Travel:
12.7 mm
Temperature Control:
Ambient to 250 Degree C
Ultrasonic Frequency:
62.5 kHz
Ultrasonic Power:
0 to 1 W to 0 to 2 W
Wire Spool Size:
0.5 Inches, 2 Inches
more info
Have a Custom Requirement?
Wire Bonders Directory