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Wire Bonders - Page 6

80 Wire Bonders from 17 Manufacturers meet your specification.
RAPID MEM Image
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Kulicke and Soffa Industries, Inc - RAPID MEM

Wire Bonder from Kulicke and Soffa Industries, Inc
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Air Consumption:
185 L/min
Bonding Area:
56 x 80 mm
Air Pressure:
3.52 kg/sq cm
Bonding Method:
Ball Bonder
Net Weight:
590 kg
Overall Dimensions:
Base Machine with MHS x 889 x 1009 mm
Power Supply:
200-240 VAC, -15% to 10%, Single Phase, 50/60 Hz, 2.6 KVA
Bonding Wire Length:
7.6 mm
Die Pad Downset:
Up to 2.3 mm
Different Leadframe Type:
8 min
Gold Wire Size:
0.6 to 2.5 mil
Leadframe Dimensions:
300 x 92 mm
Magazine Dimensions:
305 x 110 x 178 mm
Minimum Loop Height:
40 µm
Placement Accuracy:
2 µm
Same Leadframe Type:
4 min
Wire Pitch:
35 µm
Wire Sway:
25 µm
more info
RAPID Image
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Kulicke and Soffa Industries, Inc - RAPID

Wire Bonder from Kulicke and Soffa Industries, Inc
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Air Consumption:
185 L/min
Bonding Area:
56 x 80 mm
Air Pressure:
3.52 kg/sq cm
Bonding Method:
Ball Bonder
Net Weight:
590 kg
Overall Dimensions:
Base Machine with MHS x 889 x 1009 mm
Power Supply:
200-240 VAC, -15% to 10%, Single Phase, 50/60 Hz, 2.6 KVA
Bonding Wire Length:
7.6 mm
Die Pad Downset:
Up to 2.3 mm
Different Leadframe Type:
8 min
Gold Wire Size:
0.6 to 2.5 mil
Leadframe Dimensions:
300 x 92 mm
Magazine Dimensions:
305 x 110 x 178 mm
Minimum Loop Height:
40 µm
Placement Accuracy:
2 µm
Same Leadframe Type:
4 min
Wire Pitch:
35 µm
Wire Sway:
25 µm
more info
CONNX ELITE OPTO Image
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Kulicke and Soffa Industries, Inc - CONNX ELITE OPTO

Wire Bonder from Kulicke and Soffa Industries, Inc
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Air Consumption:
185 L/min
Bonding Area:
56 x 80 mm
Air Pressure:
3.52 kg/sq cm
Bonding Method:
Wire Bonder
Net Weight:
556 kg
Overall Dimensions:
Base Machine with MHS x 889 x 990 mm
Power Supply:
200-240 VAC, -15% to 10%, Single Phase, 50/60 Hz, 2.6 KVA
Bonding Wire Length:
5 mm
Die Pad Downset:
Up to 2.3 mm
Different Leadframe Type:
8 min
Gold Wire Size:
25.4 µm
Leadframe Dimensions:
300 x 92 mm
Magazine Dimensions:
305 x 98 x 178 mm
Minimum Loop Height:
65 µm
Placement Accuracy:
3 µm
Same Leadframe Type:
4 min
Wire Pitch:
1.27 to 25 mm
Wire Sway:
25 µm
more info
ASTERION SV Image
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Kulicke and Soffa Industries, Inc - ASTERION SV

Wire Bonder from Kulicke and Soffa Industries, Inc
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Bonding Area:
300 x 985 mm
Bonding Method:
Wedge Bonder
Net Weight:
1750 kg
Overall Dimensions:
800 x 2256 x 2035 mm
Power Supply:
180-240 VAC, Single Phase, 50/60 Hz, 2.0kVA
Gold Wire Size:
300 to 500 µm
Motorized Z Travel:
50 mm
Repeatability:
3 µm
Step Resolution:
0.1 µm
Workpiece Size:
1105 x 528 mm
more info
ASTERION Image
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Kulicke and Soffa Industries, Inc - ASTERION

Wire Bonder from Kulicke and Soffa Industries, Inc
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Bonding Area:
300 x 300 mm
Bonding Method:
Wedge Bonder
Net Weight:
730 kg
Overall Dimensions:
683 x 1500 x 1833 mm
Power Supply:
180-240 VAC, Single Phase, 50/60 Hz, 2.0kVA
Gold Wire Size:
100 to 500 µm, 25 to 75 µm
Motorized Z Travel:
50 mm
Repeatability:
3 µm
Ribbon Size:
500 x 100 µm to 2000 x 400 µm
Step Resolution:
0.1 µm
Wire Feed Angle:
45 Degree, 60 Degree
Workpiece Size:
695 x 407 mm
more info
POWERFUSION Image
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Kulicke and Soffa Industries, Inc - POWERFUSION

Wire Bonder from Kulicke and Soffa Industries, Inc
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Bonding Area:
80 x 78 mm
Air Pressure:
80 psi
Bonding Method:
Wedge Bonder
Net Weight:
800 kg
Overall Dimensions:
1828 x 1219 x 1676 mm
Power Supply:
180-240 VAC, Single Phase, 50/60 Hz, 4.0kVA
Gold Wire Size:
100 to 500 µm, 25 to 75 µm
Motorized Z Travel:
50 mm
Repeatability:
3 µm
Ribbon Size:
500 x 100 µm to 2000 x 250 µm
Step Resolution:
0.1 µm
Wire Feed Angle:
45 Degree, 60 Degree
Workpiece Size:
300 x 80 mm
more info
ASTERION EV Image
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Kulicke and Soffa Industries, Inc - ASTERION EV

Wire Bonder from Kulicke and Soffa Industries, Inc
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Bonding Area:
300 x 860 mm
Bonding Method:
Wedge Bonder
Net Weight:
1015 kg
Overall Dimensions:
800 x 1971 x 1955 mm
Power Supply:
180-240 VAC, Single Phase, 50/60 Hz, 2.0kVA
Gold Wire Size:
100 to 500 µm
Motorized Z Travel:
50 mm
Repeatability:
3 µm
Ribbon Size:
500 x 100 µm to 2000 x 400 µm
Step Resolution:
0.1 µm
Workpiece Size:
1070 x 528 mm
more info
iBond5000 Image
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Micro Point Pro - iBond5000

Wire Bonder from Micro Point Pro
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Bonding Area:
135 x 135 mm
Bonding Method:
Wedge Bonder
Net Weight:
31 kg
Bond Froce:
10 to 250 g
Overall Dimensions:
680 x 700 x 530 mm
Power Supply:
100 - 240V, 50/60 Hz
Bond Time:
10 to 100 ms, 10 to 1000 ms
Bonding Tool:
0.0750 to 1 Inches
Copper Wire Size:
17 to 50 µm
Fine Table Motion:
14 mm
Gold Wire Size:
17 to 75 µm
Gross Table Motion:
140 mm
Motorized X and Y Travel:
4 mm, 0.25 mm, 0.5 mm
Motorized Z Travel:
12.5 mm
Ribbon Size:
25 x 250 µm
Temperature Control:
Up to 250 Degree C
Throat Depth:
143 mm
Ultrasonic Frequency:
60 kHz
Ultrasonic Power:
1.3 to 2.5 W
Wire Feed Angle:
90 Degree
Wire Spool Size:
51 x 25 mm
more info
iBond5000-Dual Image
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Micro Point Pro - iBond5000-Dual

Wire Bonder from Micro Point Pro
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Bonding Area:
135 x 135 mm
Bonding Method:
Ball Bonder, Wedge Bonder
Net Weight:
31 kg
Aluminium Wire Size:
0.7 to 3 mils
Bond Froce:
10 to 120 g
Overall Dimensions:
680 x 700 x 530 mm
Power Supply:
100-240V, 50/60 Hz
Bond Time:
10 to 100 ms, 10 to 1000 ms
Bonding Tool:
19 to 21 mm
Copper Wire Size:
20 to 75 µm
Fine Table Motion:
14 mm
Gold Wire Size:
17 to 70 µm
Gross Table Motion:
140 mm
Motorized X and Y Travel:
4 mm, 0.25 mm, 0.5 mm
Motorized Z Travel:
12.5 mm
Ribbon Size:
25 x 250 µm
Temperature Control:
180 Degree C, 5 Degree C
Throat Depth:
143 mm
Ultrasonic Frequency:
60 kHz
Ultrasonic Power:
1.3 to 3.0 W
Wire Feed Angle:
90 Degree
Wire Spool Size:
2 x 1 Inches
more info
iBond5000-Ball Image
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Micro Point Pro - iBond5000-Ball

Wire Bonder from Micro Point Pro
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Bonding Area:
135 x 135 mm
Bonding Method:
Ball Bonder, Wedge Bonder, Wire Bonder
Net Weight:
31 kg
Bond Froce:
10 to 250 g
Overall Dimensions:
680 x 700 x 530 mm
Power Supply:
100-240V, 50/60 Hz
Bond Time:
10 to 100 ms, 10 to 1000 ms
Bonding Tool:
9 mm, 11 mm, 15 mm
Copper Wire Size:
17 to 50 µm
Fine Table Motion:
14 mm
Gold Wire Size:
17 to 75 µm
Gross Table Motion:
140 mm
Motorized X and Y Travel:
4 mm, 0.25 mm, 0.5 mm
Motorized Z Travel:
12.5 mm
Temperature Control:
250 Degree C, +/- 5 Degree C
Throat Depth:
143 mm
Ultrasonic Frequency:
60 kHz
Ultrasonic Power:
1.3 to 2.5 W
Wire Feed Angle:
90 Degree
Wire Spool Size:
2 x 1 Inches
more info
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