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Wire Bonders - Page 7

80 Wire Bonders from 17 Manufacturers meet your specification.
Q7700 Image
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Questar Products International, Inc - Q7700

Wire Bonder from Questar Products International, Inc
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Bond Speed:
500 ms
Bonding Area:
4 x 4 Inches
Bonding Method:
Ball Bonder
Net Weight:
227 kg
Overall Dimensions:
880 x 990 x 1830 mm
Power Supply:
120 VAC, 50/60 Hz, 15A
Gold Wire Size:
0.0008 to 0.002 Inches
Step Resolution:
1.6 µm
Wire Pitch:
69.9 µm
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Q7800 Image
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Questar Products International, Inc - Q7800

Wire Bonder from Questar Products International, Inc
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Bond Speed:
600 ms
Bonding Area:
4 x 3.65 Inches
Bonding Method:
Wedge Bonder
Net Weight:
273 kg
Aluminium Wire Size:
17.78 to 76.2 µm
Overall Dimensions:
880 x 990 x 1830 mm
Power Supply:
120 VAC, 50/60 Hz, 15A
Gold Wire Size:
17.78 to 76.2 µm
Step Resolution:
1.6 µm
Wire Feed Angle:
30 Degree, 38 Degree, 45 Degree, 60 Degree
Wire Pitch:
69.85 µm
Wire Spool Size:
50.8 mm
more info
HB05 Image
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TPT Wire Bonder GmbH & Co KG - HB05

Wire Bonder from TPT Wire Bonder GmbH & Co KG
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Bonding Method:
Ball Bonder, Wedge Bonder, Bumb Bonder
Net Weight:
25 kg
Aluminium Wire Size:
17 to 75 µm
Bond Froce:
5 to 200 cN
Overall Dimensions:
550 x 450 x 250 mm
Power Supply:
100-240V, +/-10%, 50/60 Hz, 10A max
Bond Time:
0 to 20000 ms
Bonding Tool:
19 mm
Fine Table Motion:
15 mm
Gold Wire Size:
17 to 75 µm
Ribbon Size:
25 x 250 µm
Temperature Control:
Up to 250 Degree C
Throat Depth:
165 mm
Ultrasonic Frequency:
63.3 kHz
Ultrasonic Power:
0 to 10 W output
Wire Feed Angle:
90 Degree
Wire Spool Size:
50.8 mm
more info
HB10 Image
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TPT Wire Bonder GmbH & Co KG - HB10

Wire Bonder from TPT Wire Bonder GmbH & Co KG
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Bonding Method:
Ball Bonder, Wedge Bonder
Net Weight:
42 kg
Aluminium Wire Size:
17 to 75 µm
Number of Heads:
1 Head
Bond Froce:
5 to 150 cN
Overall Dimensions:
680 x 640 x 490 mm
Power Supply:
100-240V, +/-10%, 50/60 Hz, 10A max
Bond Time:
0 to 20000 ms
Bonding Tool:
19 mm
Fine Table Motion:
10 mm
Gold Wire Size:
17 to 75 µm
Motorized Z Travel:
17 mm
Ribbon Size:
25 x 250 µm
Temperature Control:
Up to 250 Degree C
Throat Depth:
165 mm
Ultrasonic Frequency:
63.3 kHz
Ultrasonic Power:
0 to 10 W output
Wire Feed Angle:
90 Degree
Wire Spool Size:
50.8 mm
more info
HB100 Image
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TPT Wire Bonder GmbH & Co KG - HB100

Wire Bonder from TPT Wire Bonder GmbH & Co KG
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Bond Speed:
1 Wire in 3 sec
Bonding Method:
Ball Bonder, Wedge Bonder
Net Weight:
72 kg
Aluminium Wire Size:
17 to 75 µm
Number of Heads:
1 Head
Bond Froce:
10 to 200 cN
Overall Dimensions:
620 x 750 x 680 mm
Power Supply:
100-240V, +/-10%, 50/60 Hz, 10A max
Bond Time:
0 to 5 sec
Bonding Tool:
19 mm
Gold Wire Size:
17 to 75 µm
Maximum Component Width:
400 mm
Motorized X and Y Travel:
100 mm
Motorized Z Travel:
100 mm
Ribbon Size:
25 x 250 µm
Temperature Control:
Up to 200 Degree C
Ultrasonic Frequency:
63.3 kHz
Ultrasonic Power:
0 to 10 W output
Wire Feed Angle:
90 Degree
Wire Spool Size:
50.8 mm
more info
HB16 Image
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TPT Wire Bonder GmbH & Co KG - HB16

Wire Bonder from TPT Wire Bonder GmbH & Co KG
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Bonding Method:
Ball Bonder, Wedge Bonder, Bumb Bonder
Net Weight:
42 kg
Aluminium Wire Size:
17 to 75 µm
Number of Heads:
1 Head
Bond Froce:
5 to 150 cN
Overall Dimensions:
680 x 640 x 490 mm
Power Supply:
100-240V, +/-10%, 50/60 Hz, 10A max
Bond Time:
0 to 20000 ms
Bonding Tool:
19 mm
Fine Table Motion:
10 mm
Gold Wire Size:
17 to 75 µm
Motorized X and Y Travel:
10 mm
Motorized Z Travel:
17 mm
Ribbon Size:
25 x 250 µm
Temperature Control:
Up to 250 Degree C
Throat Depth:
165 mm
Ultrasonic Frequency:
63.3 kHz
Ultrasonic Power:
0 to 10 W output
Wire Feed Angle:
90 Degree
Wire Spool Size:
50.8 mm
more info
HB30 Image
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TPT Wire Bonder GmbH & Co KG - HB30

Wire Bonder from TPT Wire Bonder GmbH & Co KG
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Bonding Method:
Wedge Bonder
Net Weight:
50 kg
Aluminium Wire Size:
100 to 500 µm
Bond Froce:
50 to 1800 cN
Overall Dimensions:
680 x 640 x 490 mm
Power Supply:
100-240V, +/-10%, 50/60 Hz, 10A max
Bond Time:
0 to 10 sec
Fine Table Motion:
15 mm
Gold Wire Size:
100 to 500 µm
Motorized X and Y Travel:
17 mm
Motorized Z Travel:
20 mm
Ribbon Size:
300 x 2000 µm
Ultrasonic Power:
50 W output
Wire Feed Angle:
90 Degree
more info
HB02 Image
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TPT Wire Bonder GmbH & Co KG - HB02

Wire Bonder from TPT Wire Bonder GmbH & Co KG
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Bonding Method:
Wire Bonder, Wedge Bonder, Ribbon bonder
Net Weight:
25 kg
Aluminium Wire Size:
17 to 75 µm
Bond Froce:
5 to 200 cN
Overall Dimensions:
550 x 450 x 250 mm
Power Supply:
100-240 V +/-10 % 50/60 Hz 10 A max
Bond Time:
0 to 20000 ms
Bonding Tool:
19 mm
Fine Table Motion:
15 mm
Gold Wire Size:
17 to 75 µm
Ribbon Size:
25 x 250 µm
Temperature Control:
250 Degree C
Throat Depth:
165 mm
Ultrasonic Frequency:
63.3 kHz
Ultrasonic Power:
0 to 10 W
Wire Feed Angle:
90 Degree
Wire Spool Size:
50.8 mm
more info
7KF Image
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West Bond Inc - 7KF

Wire Bonder from West Bond Inc
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Bonding Area:
280 x 280 mm, 508 x 208 mm
Air Pressure:
50 psi
Bonding Method:
Ball Bonder, Wedge Bonder, Wire Bonder
Net Weight:
63.5 kg
Aluminium Wire Size:
18 to 75 µm
Bond Froce:
15 to 120 g
Overall Dimensions:
610 x 571 x 311 mm
Power Supply:
100 - 240 VAC 50/60Hz
Bond Time:
0 to 999 ms
Bonding Tool:
1.58 mm
Motorized X and Y Travel:
17.8 mm2
Motorized Z Travel:
14.3 mm
Ribbon Size:
12.5 x 50 µm to 25 x 250 µm
Ultrasonic Frequency:
63 kHz, 110 kHz
Ultrasonic Power:
2.5 W, 4 W
Wire Feed Angle:
45 Degree, 90 Degree
Wire Spool Size:
50.8 mm
more info
4KE Image
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West Bond Inc - 4KE

Wire Bonder from West Bond Inc
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Bonding Area:
280 x 280 mm, 508 x 208 mm
Air Pressure:
50 psi
Bonding Method:
Ball Bonder, Wedge Bonder, Wire Bonder
Net Weight:
75 kg
Aluminium Wire Size:
18 to 75 µm
Bond Froce:
10 to 250 g
Overall Dimensions:
615 x 566 x 295 mm
Power Supply:
100 - 120/220 - 240 VAC 50/60 Hz
Bond Time:
0 to 999 ms
Bonding Tool:
1.58 mm
Motorized X and Y Travel:
12.7 mm
Motorized Z Travel:
12.7 mm
Ribbon Size:
12.5 x 50 µm to 25 x 250 µm
Ultrasonic Frequency:
63 kHz, 110 kHz
Ultrasonic Power:
2.5 W, 4 W
Wire Feed Angle:
45 Degree, 90 Degree
Wire Spool Size:
50.8 mm
more info
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