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Die Bonders - Page 7

125 Die Bonders from 31 Manufacturers meet your specification.
AvantGo L2 Image
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Capcon Limited Co., Ltd - AvantGo L2

Die Bonder from Capcon Limited Co., Ltd
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Bond Force:
120 to 5000 g
Bond Head:
4 Heads
Bonding Method:
Die Bonder
Heated Bond Head:
160 Degree C
Overall Dimensions:
1480 x 2020 x 1870 mm
Substrate Working Range:
750 x 700 mm
Type:
Automatic
Wafer Die attach Placement Speed:
3000 UPH
Wafer Die Attach Size:
0.5 to 30 mm, 30 to 100 mm
Wafer Size:
12 Inches, 8 Inches
X Y Placement Accuracy:
2 µm
more info
AvantGo L4 Image
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Capcon Limited Co., Ltd - AvantGo L4

Die Bonder from Capcon Limited Co., Ltd
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Bond Force:
120 to 3200 g
Bond Head:
8 Heads
Bonding Method:
Die Bonder
Heated Bond Head:
160 Degree C
Overall Dimensions:
1480 x 2020 x 1870 mm
Substrate Working Range:
330 x 300 mm
Type:
Automatic
Wafer Die Attach Size:
0.5 to 30 mm, 30 to 100 mm
Wafer Size:
12 Inches, 8 Inches
X Y Placement Accuracy:
5 µm
more info
AvantGo L6 Image
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Capcon Limited Co., Ltd - AvantGo L6

Die Bonder from Capcon Limited Co., Ltd
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Bond Force:
120 to 3200 g
Bond Head:
12 Heads
Bonding Method:
Die Bonder
Heated Bond Head:
160 Degree C
Overall Dimensions:
1686 x 2020 x 1892 mm
Substrate Working Range:
750 x 700 mm
Type:
Automatic
Wafer Die attach Placement Speed:
11000 UPH
Wafer Die Attach Size:
0.5 to 30 mm, 30 to 100 mm
Wafer Size:
12 Inches, 8 Inches
X Y Placement Accuracy:
3 µm
more info
T-4909-AE Image
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Dr. Tresky Ag - T-4909-AE

Die Bonder from Dr. Tresky Ag
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Bond Force:
20 to 1000 g
Bonding Method:
Die Bonder
Compressed Air:
5 to 6 bar
Net Weight:
33 kg
Overall Dimensions:
755 x 730 x 500 mm
Power Supply:
110V-220V
Standard Bond Head:
360 Degree
Type:
Manual
Wafer Size:
180 x 180 mm
X Y Placement Accuracy:
± 10 µm
more info
T-5100 Image
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Dr. Tresky Ag - T-5100

Die Bonder from Dr. Tresky Ag
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Bond Force:
20 to 1000 g
Bonding Method:
Die Bonder
Net Weight:
90 kg
Overall Dimensions:
1155 x 790 x 728 mm
Power Supply:
110V-220V
Standard Bond Head:
360 Degree
Substrate Working Range:
400 x 280 mm
Type:
Manual
Wafer Size:
220 x 220 mm
X Y Placement Accuracy:
± 10 µm
more info
T-5100-W Image
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Dr. Tresky Ag - T-5100-W

Die Bonder from Dr. Tresky Ag
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Bond Force:
20 to 1000 g
Bonding Method:
Die Bonder
Net Weight:
90 kg
Overall Dimensions:
1155 x 790 x 728 mm
Power Supply:
110V-220V
Standard Bond Head:
360 Degree
Substrate Working Range:
400 x 280 mm
Type:
Manual
Wafer Size:
220 x 220 mm
X Y Placement Accuracy:
± 10 µm
more info
T-5300 Image
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Dr. Tresky Ag - T-5300

Die Bonder from Dr. Tresky Ag
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Bond Force:
20 to 4000 g, 10 to 10000 g
Bonding Method:
Die Bonder
Net Weight:
95 kg
Overall Dimensions:
1155 x 790 x 728 mm
Power Supply:
110V-220V
Standard Bond Head:
360 Degree
Substrate Working Range:
400 x 280 mm
Type:
Semi Automatic
Wafer Size:
220 x 220 mm
X Y Placement Accuracy:
± 10 µm
more info
T-5300-W Image
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Dr. Tresky Ag - T-5300-W

Die Bonder from Dr. Tresky Ag
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Bond Force:
20 to 4000 g, 10 to 10000 g
Bonding Method:
Die Bonder
Net Weight:
95 kg
Overall Dimensions:
1155 x 790 x 728 mm
Power Supply:
110V-220V
Standard Bond Head:
360 Degree
Substrate Working Range:
400 x 280 mm
Type:
Semi Automatic
Wafer Size:
220 x 220 mm
X Y Placement Accuracy:
± 10 µm
more info
FINEPLACER femto 2 Image
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Finetech GmbH & Co. KG - FINEPLACER femto 2

Die Bonder from Finetech GmbH & Co. KG
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Bond Force:
0.05 to 1000 N
Bonding Method:
Die Bonder
Substrate Working Range:
300 mm
Type:
Automatic
X Y Placement Accuracy:
0.3 µm at 3 sigma
more info
FINEPLACER femto pro Image
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Finetech GmbH & Co. KG - FINEPLACER femto pro

Die Bonder from Finetech GmbH & Co. KG
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Bond Force:
0.05 to 1000 N
Bonding Method:
Die Bonder
Substrate Working Range:
300 x 150 mm
Type:
Automatic
X Y Placement Accuracy:
2.0 µm at 3 Sigma
more info
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