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Die Bonders - Page 8

125 Die Bonders from 31 Manufacturers meet your specification.
FineXT 6003 Image
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Finetech GmbH & Co. KG - FineXT 6003

Die Bonder from Finetech GmbH & Co. KG
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Bond Force:
0.5 to 75 N
Bonding Method:
Die Bonder
Substrate Working Range:
600 x 600 mm
Type:
Automatic
X Y Placement Accuracy:
3 µm
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MD-1412 Image
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Guangzhou Minder-Hightech Co.,Ltd - MD-1412

Die Bonder from Guangzhou Minder-Hightech Co.,Ltd
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Bonding Method:
Die Bonder
Compressed Air:
6 bar
Net Weight:
1700 kg
Overall Dimensions:
2000 x 1200 x 1800 mm
Power Supply:
220 VAC, 50Hz, 600-1000 W
Substrate Working Range:
76 x 101 mm
Type:
Automatic
Wafer Die attach Placement Speed:
5000 to 6000 UPH
Wafer Die Attach Size:
12 x 212 mm, 1.65 x 1.65 mm, 1.20 x 1.27 mm, 1.96 x 1.51 mm
Wafer Size:
12 Inches, 8 Inches, 6 Inches
X Y Placement Accuracy:
± 25 µm
more info
SDB-1 Image
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Hanwha Precision Machinery Co., Ltd - SDB-1

Die Bonder from Hanwha Precision Machinery Co., Ltd
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Bond Head:
4 Heads
Bonding Method:
Die Bonder
Type:
Automatic
Wafer Die attach Placement Speed:
6000 UPH
X Y Placement Accuracy:
±5 µm
more info
SFM3 Image
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Hanwha Precision Machinery Co., Ltd - SFM3

Die Bonder from Hanwha Precision Machinery Co., Ltd
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Bond Head:
4 Heads
Bonding Method:
Flip Chip Bonder
Type:
Automatic
Wafer Die Attach Size:
10.5 to 32 mm
Wafer Die Thickness:
0.04 to 3 mm
Wafer Flip Chip Placement Speed:
10000 UPH
Wafer Size:
152 to 305 mm
X Y Placement Accuracy:
5 µm
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SFM5 Image
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Hanwha Precision Machinery Co., Ltd - SFM5

Die Bonder from Hanwha Precision Machinery Co., Ltd
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Bond Head:
8 Heads
Bonding Method:
Flip Chip Bonder
Type:
Automatic
Wafer Die Attach Size:
1.5 to 12 mm, 46 mm
Wafer Flip Chip Placement Speed:
15000 UPH
Wafer Size:
8 to 12 Inches
X Y Placement Accuracy:
5 µm
more info
DBX-1000 Image
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Kaijo Corporation - DBX-1000

Die Bonder from Kaijo Corporation
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Bonding Cycle Time:
0.18 sec/cycle
Bonding Method:
Die Bonder
Net Weight:
930 kg
Overall Dimensions:
1750 x 1080 x 2050 mm
Type:
Automatic
Wafer Die Attach Size:
0.15 to 1.5 mm
Wafer Size:
4 Inches, 6 Inches
X Y Placement Accuracy:
±25 µm
more info
APAMA PLUS-S Image
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Kulicke and Soffa Industries, Inc - APAMA PLUS-S

Die Bonder from Kulicke and Soffa Industries, Inc
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Bond Force:
3 to 300 N
Bonding Method:
Die Bonder
Cooling Rate:
140 Degree C/sec
Overall Dimensions:
4090 x 1860 x 2190 mm
Ramping Speed:
350 Degree C/sec
Substrate Working Range:
100 x 300 mm
Type:
Automatic
Wafer Die Attach Size:
1 to 20 mm
Wafer Die Thickness:
75 µm
more info
APAMA PLUS-W Image
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Kulicke and Soffa Industries, Inc - APAMA PLUS-W

Die Bonder from Kulicke and Soffa Industries, Inc
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Bond Force:
3 to 300 N
Bonding Method:
Die Bonder
Cooling Rate:
140 Degree C/sec
Overall Dimensions:
2750 x 1860 x 2190 mm
Ramping Speed:
350 Degree C/sec
Substrate Working Range:
203 mm, 305 mm
Type:
Automatic
Wafer Die Attach Size:
1 to 20 mm
Wafer Die Thickness:
75 µm
Wafer Size:
8 Inches, 12 Inches
more info
AVALINE-C Image
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Kulicke and Soffa Industries, Inc - AVALINE-C

Die Bonder from Kulicke and Soffa Industries, Inc
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Bond Force:
20 to 1000 g
Bonding Method:
Die Bonder
Frame Size:
300 x 105 mm
Type:
Automatic
Wafer Die attach Placement Speed:
2400 UPH
Wafer Die Attach Size:
0.25 to 10 mm
Wafer Die Thickness:
0.1 to 0.4 mm
Wafer Size:
6 Inches, 8 Inches, 12 Inches
X Y Placement Accuracy:
50 µm
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AVALINE-D Image
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Kulicke and Soffa Industries, Inc - AVALINE-D

Die Bonder from Kulicke and Soffa Industries, Inc
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Bond Force:
20 to 300 g
Bonding Method:
Die Bonder
Frame Size:
300 x 105 mm
Type:
Automatic
Wafer Die attach Placement Speed:
15000 UPH
Wafer Die Attach Size:
0.5 to 10 mm
Wafer Die Thickness:
50 to 750 µm
Wafer Size:
6 Inches, 8 Inches, 12 Inches
X Y Placement Accuracy:
25 µm
more info
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