1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Die Bonders
Filters

Die Bonders - Page 12

125 Die Bonders from 31 Manufacturers meet your specification.
STC-800 Image
 Download Datasheet  Request Information  Product Details

Yamaha Motor Corporation - STC-800

Die Bonder from Yamaha Motor Corporation
 Download Datasheet  Request Information
Bond Head:
2 Heads
Bonding Cycle Time:
0.140 s/chip
Bonding Method:
Die Bonder
Chip Size:
0.12 to 1.5 mm
Compressed Air:
400 kPa (4kgf/cm2)
Net Weight:
1160 kg
Overall Dimensions:
1115 x 1130 x 2110 mm
Power Supply:
Single Phase AC 200V±5% 50/60 Hz, 2.0 kW
Type:
Automatic
Wafer Die attach Placement Speed:
21400 UPH
Wafer Size:
8 Inches
Workpiece Size:
300 x 86 mm
X Y Placement Accuracy:
20 µm, 15 µm
more info
FPB-1s NeoForce Image
 Download Datasheet  Request Information  Product Details

Yamaha Motor Corporation - FPB-1s NeoForce

Die Bonder from Yamaha Motor Corporation
 Download Datasheet  Request Information
Bond Force:
0.3 to 350 N
Bonding Method:
Flip Chip Bonder
Bonding Stage Setting Temperature:
Room Temp to 110 Degree C
Bonding Tool Setting Temperature:
Room Temp to 400 Degree C
Chip Size:
1 to 22 mm
Compressed Air:
570 kPa 300 L/min
Net Weight:
2500 kg
Overall Dimensions:
1510 x 1620 x 1750 mm
Power Supply:
Single Phase AC200V–240V ±5%, 50/60 Hz, 14 kW
Substrate Thickness:
0.2 to 2.5 mm
Substrate Working Range:
300 x 200 mm
Type:
Automatic
Wafer Chip Thickness:
0.7 mm
Wafer Flip Chip Placement Speed:
6000 UPH
Wafer Size:
200 mm, 300 mm
X Y Placement Accuracy:
2.5 µm
more info
FPB-1w NeoForce Image
 Download Datasheet  Request Information  Product Details

Yamaha Motor Corporation - FPB-1w NeoForce

Die Bonder from Yamaha Motor Corporation
 Download Datasheet  Request Information
Bond Force:
0.3 to 350 N
Bonding Method:
Flip Chip Bonder
Bonding Stage Setting Temperature:
Room Temp to 200 Degree C
Bonding Tool Setting Temperature:
Room Temp to 400 Degree C
Chip Size:
1 to 22 mm
Compressed Air:
570 kPa 300 L/min
Net Weight:
3100 kg
Overall Dimensions:
2520 x 1620 x 1750 mm
Power Supply:
Single Phase AC200V–240V ±5%, 50/60 Hz, 14 kW
Type:
Automatic
Wafer Chip Thickness:
0.02 to 7 mm
Wafer Flip Chip Placement Speed:
6000 UPH
Wafer Size:
200 mm, 300 mm
X Y Placement Accuracy:
2.5 µm
more info
FPB-1ws NeoForce Image
 Download Datasheet  Request Information  Product Details

Yamaha Motor Corporation - FPB-1ws NeoForce

Die Bonder from Yamaha Motor Corporation
 Download Datasheet  Request Information
Bond Force:
0.3 to 350 N
Bonding Method:
Flip Chip Bonder
Bonding Stage Setting Temperature:
Room Temp to 200 Degree C
Bonding Tool Setting Temperature:
Room Temp to 400 Degree C
Chip Size:
1 to 22 mm
Compressed Air:
570 kPa 300 L/min
Net Weight:
3100 kg
Overall Dimensions:
2520 x 1620 x 1750 mm
Power Supply:
Single Phase AC200V–240V ±5%, 50/60 Hz, 14 kW
Type:
Automatic
Wafer Chip Thickness:
0.02 to 7 mm
Wafer Flip Chip Placement Speed:
6000 UPH
Wafer Size:
200 mm, 300 mm
X Y Placement Accuracy:
2.5 µm
more info
FPB-1dw NeoForce Image
 Download Datasheet  Request Information  Product Details

Yamaha Motor Corporation - FPB-1dw NeoForce

Die Bonder from Yamaha Motor Corporation
 Download Datasheet  Request Information
Bond Force:
0.3 to 350 N
Bonding Method:
Flip Chip Bonder
Bonding Stage Setting Temperature:
Room Temp to 200 Degree C
Bonding Tool Setting Temperature:
Room Temp to 400 Degree C
Chip Size:
1 to 22 mm
Compressed Air:
570 kPa 300 L/min
Net Weight:
5600 kg
Overall Dimensions:
4540 x 1630 x 1750 mm
Power Supply:
Single Phase AC200V–240V ±5%, 50/60 Hz, 28 kW
Type:
Automatic
Wafer Chip Thickness:
0.02 to 7 mm
Wafer Flip Chip Placement Speed:
12000 UPH
Wafer Size:
200 mm, 300 mm
X Y Placement Accuracy:
2.5 µm
more info
AFM-15 (1505) Image
 Download Datasheet  Request Information  Product Details

Yamaha Motor Corporation - AFM-15 (1505)

Die Bonder from Yamaha Motor Corporation
 Download Datasheet  Request Information
Bond Force:
25 N
Bonding Cycle Time:
0.78 sec/Chip
Bonding Method:
Flip Chip Bonder
Chip Size:
2.5 x 2.5 mm
Net Weight:
1800 kg
Overall Dimensions:
1200 x 1504 x 1650 mm
Substrate Thickness:
3 mm
Substrate Working Range:
180 x 120 mm
Type:
Automatic
Wafer Chip Thickness:
0.1 to 1 mm
Wafer Size:
5 Inches, 6 Inches, 8 Inches, 12 Inches
X Y Placement Accuracy:
7 µm
more info
AFM-15 (1508) Image
 Download Datasheet  Request Information  Product Details

Yamaha Motor Corporation - AFM-15 (1508)

Die Bonder from Yamaha Motor Corporation
 Download Datasheet  Request Information
Bond Force:
25 N
Bonding Cycle Time:
0.59 sec/Chip
Bonding Method:
Flip Chip Bonder
Chip Size:
2.5 x 2.5 mm
Net Weight:
1500 kg
Overall Dimensions:
980 x 1040 x 1860 mm
Substrate Thickness:
3 mm
Substrate Working Range:
170 x 105 mm
Type:
Automatic
Wafer Chip Thickness:
0.1 to 1 mm
Wafer Size:
5 Inches, 6 Inches
X Y Placement Accuracy:
7 µm
more info
AFM-15 (1562) Image
 Download Datasheet  Request Information  Product Details

Yamaha Motor Corporation - AFM-15 (1562)

Die Bonder from Yamaha Motor Corporation
 Download Datasheet  Request Information
Bond Force:
25 N
Bonding Cycle Time:
1.35 sec/Chip
Bonding Method:
Flip Chip Bonder
Chip Size:
7 x 7 mm
Net Weight:
2100 kg
Overall Dimensions:
1980 x 1620 x 1566 mm
Substrate Thickness:
3 mm
Substrate Working Range:
180 x 120 mm
Type:
Automatic
Wafer Chip Thickness:
0.1 to 1 mm
Wafer Size:
8 Inches, 12 Inches
X Y Placement Accuracy:
5 µm, 3 µm
more info
YSH20 Image
 Download Datasheet  Request Information  Product Details

Yamaha Motor Corporation - YSH20

Die Bonder from Yamaha Motor Corporation
 Download Datasheet  Request Information
Bond Head:
8 Heads
Bonding Cycle Time:
0.8 sec/unit, 1 sec/unit
Bonding Method:
Flip Chip Bonder
Compressed Air:
5 bar
Net Weight:
2780 kg
Overall Dimensions:
1400 x 2035 x 1515 mm
Power Supply:
3-phase AC 200-416V, +/- 10%, 50/60 Hz
Type:
Automatic
Wafer Die Attach Size:
0.6 to 18 mm
Wafer Flip Chip Placement Speed:
4500 UPH
Wafer Size:
6 Inches, 8 Inches, 12 Inches
X Y Placement Accuracy:
± 10 µm
more info
TO Series Soft Solder Die Bonder Image
 Download Datasheet  Request Information  Product Details

Shenzhen Liande Automation Equipment Co., Ltd - TO Series Soft Solder Die Bonder

Die Bonder from Shenzhen Liande Automation Equipment Co., Ltd
 Download Datasheet  Request Information
Bond Force:
30 to 500 g
Bonding Method:
Die Bonder
Overall Dimensions:
2300 x 1380 x 1420 mm
Type:
Automatic
Wafer Size:
6 Inches, 8 Inches, 12 Inches
X Y Placement Accuracy:
=±40 µm
more info
Have a Custom Requirement?
Die Bonders Directory