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Die Bonders - Page 11

125 Die Bonders from 31 Manufacturers meet your specification.
AFM-15 (1503) Image
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TDK Corporation - AFM-15 (1503)

Die Bonder from TDK Corporation
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Bond Force:
25 N, 50 N, 100 N
Bonding Cycle Time:
0.8 sec/chip
Bonding Method:
Flip Chip Bonder
Chip Size:
2.5 x 2.5 mm
Net Weight:
1800 kg
Overall Dimensions:
1200 x 1450 x 1650 mm
Substrate Thickness:
3 mm
Substrate Working Range:
180 x 120 mm
Type:
Automatic
Wafer Size:
5 Inches, 6 Inches, 8 Inches, 12 Inches
X Y Placement Accuracy:
± 7 µm
more info
AFM-15 (1504) Image
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TDK Corporation - AFM-15 (1504)

Die Bonder from TDK Corporation
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Bond Force:
25 N, 50 N, 100 N
Bonding Cycle Time:
0.75 sec/chip
Bonding Method:
Flip Chip Bonder
Chip Size:
2.5 x 2.5 mm
Net Weight:
1500 kg
Overall Dimensions:
980 x 1020 x 1860 mm
Substrate Thickness:
3 mm
Substrate Working Range:
170 x 105 mm
Type:
Automatic
Wafer Size:
5 Inches, 6 Inches
X Y Placement Accuracy:
± 7 µm
more info
AFM-25 Image
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TDK Corporation - AFM-25

Die Bonder from TDK Corporation
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Bond Force:
372.4 N
Bonding Cycle Time:
2.5 sec/chip
Bonding Method:
Flip Chip Bonder
Chip Size:
30 x 30 mm
Net Weight:
1100 kg
Overall Dimensions:
750 x 910 x 1760 mm
Substrate Thickness:
1.6 mm
Substrate Working Range:
200 x 120 mm
Type:
Automatic
Wafer Size:
2 Inches
X Y Placement Accuracy:
± 2 µm
more info
MDM-50 Image
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TDK Corporation - MDM-50

Die Bonder from TDK Corporation
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Bonding Method:
Flip Chip Bonder
Net Weight:
600 kg
Overall Dimensions:
740 x 1140 x 1650 mm
Substrate Thickness:
2 mm
Substrate Working Range:
200 x 150 mm
Type:
Automatic
X Y Placement Accuracy:
± 3 µm
more info
MD5000 Image
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Toray Engineering Co.,Ltd - MD5000

Die Bonder from Toray Engineering Co.,Ltd
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Bond Force:
0.1 to 3000 N
Bonding Method:
Flip Chip Bonder
Chip Size:
0.3 to 125 mm
Type:
Automatic
Wafer Size:
0.3 mm to PLP size
X Y Placement Accuracy:
2 µm
more info
FC3000W Image
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Toray Engineering Co.,Ltd - FC3000W

Die Bonder from Toray Engineering Co.,Ltd
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Bond Force:
0.1 to 3000 N
Bonding Method:
Flip Chip Bonder
Chip Size:
0.3 to 125 mm
Type:
Automatic
Wafer Size:
0.3 mm to PLP size
X Y Placement Accuracy:
2 µm
more info
FC6000H Image
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Toray Engineering Co.,Ltd - FC6000H

Die Bonder from Toray Engineering Co.,Ltd
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Bond Force:
0.1 to 3000 N
Bonding Method:
Flip Chip Bonder
Chip Size:
0.3 to 125 mm
Type:
Automatic
Wafer Size:
0.3 mm to PLP size
X Y Placement Accuracy:
2 µm
more info
FC5000M Image
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Toray Engineering Co.,Ltd - FC5000M

Die Bonder from Toray Engineering Co.,Ltd
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Bond Force:
0.1 to 3000 N
Bonding Method:
Flip Chip Bonder
Chip Size:
0.3 to 125 mm
Type:
Automatic
Wafer Size:
0.3 mm to PLP size
X Y Placement Accuracy:
2 µm
more info
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West Bond Inc - 73KF

Die Bonder from West Bond Inc
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Bond Force:
15 to 150 g
Bonding Method:
Die Bonder
Compressed Air:
50 psi
Net Weight:
53.5 kg
Overall Dimensions:
610 x 572 x 311 mm
Power Supply:
100-240 VAC 50/60 Hz
Substrate Working Range:
280 x 280 mm, 508 x 508 mm
Type:
Manual
more info
YSB55w Image
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Yamaha Motor Corporation - YSB55w

Die Bonder from Yamaha Motor Corporation
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Bond Head:
8 Heads
Bonding Method:
Flip Chip Bonder
Compressed Air:
4.5 bar
Net Weight:
3600 kg
Overall Dimensions:
2090 x 1866 x 1550 mm
Power Supply:
3-Phase AC 200/208/220/240/380/400/416V ±10% 50/60 Hz
Substrate Thickness:
0.2 to 3 mm
Substrate Working Range:
240 x 200 mm to 50 x 50 mm
Type:
Automatic
Wafer Die attach Placement Speed:
13000 UPH
Wafer Die Attach Size:
2 to 30 mm
Wafer Size:
12 Inches
X Y Placement Accuracy:
± 5 µm
more info
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