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125 Die Bonders from 31 Manufacturers meet your specification.
CoS Image
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ASMPT SEMI USA, Inc - CoS

Die Bonder from ASMPT SEMI USA, Inc
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Bond Force:
3 g up to 500 g
Bond Head:
2 Heads
Bonding Cycle Time:
5 to 10 sec
Bonding Method:
Die Bonder
Compressed Air:
6 bar
Heated Bond Head:
Up to 350 Degree C
Net Weight:
2800 kg
Overall Dimensions:
2094 x 1550 x 1973 mm
Power Supply:
400 V, 100 W
Substrate Working Range:
0.3 x 0.3 mm up to 16 x 16 mm
Type:
Automatic
Wafer Die Attach Size:
0.15 x 0.15 mm up to 3 x 8 mm
Wafer Size:
300 x 300 mm, 200 x 300 mm
X Y Placement Accuracy:
± 1.5 to 7 µm
more info
NANO Image
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ASMPT SEMI USA, Inc - NANO

Die Bonder from ASMPT SEMI USA, Inc
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Bond Force:
3 g up to 2000 g
Bonding Cycle Time:
18 sec
Bonding Method:
Die Bonder, Flip Chip Bonder
Compressed Air:
5.5 bar
Heated Bond Head:
Up to 350 Degree C
Net Weight:
2600 kg
Overall Dimensions:
2000 x 1600 x 2400 mm
Power Supply:
400 V
Substrate Working Range:
Very Small Submounts to 300 mm
Type:
Automatic
Wafer Size:
300 x 300 mm
X Y Placement Accuracy:
± 0.2 µm
more info
Nova Plus Image
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ASMPT SEMI USA, Inc - Nova Plus

Die Bonder from ASMPT SEMI USA, Inc
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Bond Force:
Up to 5000 g
Bonding Cycle Time:
3 to 5 sec
Bonding Method:
Die Bonder, Flip Chip Bonder
Compressed Air:
5 bar
Field of View:
4.6 x 3.5 mm2
Heated Bond Head:
Up to 350 Degree C
Net Weight:
2100 kg
Overall Dimensions:
1240 x 2140 x 1980 mm
Power Supply:
400 V 3 Phase
Substrate Working Range:
550 x 600 mm
Type:
Automatic
Wafer Size:
300 x 300 mm
X Y Placement Accuracy:
± 1 µm
more info
Datacon 2200 evo Image
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BE Semiconductor Industries N.V. - Datacon 2200 evo

Die Bonder from BE Semiconductor Industries N.V.
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Bond Force:
0.5 to 75 N programmable
Bond Head:
4 Heads
Bonding Method:
Die Bonder
Chip Trays Waffle Pack:
51 x 51 mm, 102 x 102 mm
Frame Size:
FF070, FF105, FF108, FF123
Heated Bond Head:
Up to 450 Degree C
Net Weight:
1300 kg
Overall Dimensions:
1160 x 1225 x 1750 mm
Standard Bond Head:
0 Degree to 360 Degree rotation
Substrate Working Range:
325 x 200 mm
Theta Placement Accuracy:
± 0.15 Degree
Type:
Automatic
Wafer Die attach Placement Speed:
Up to 7000 UPH
Wafer Die Attach Size:
0.17 to 50 mm
Wafer Die Thickness:
>50 µm
Wafer Flip Chip Placement Speed:
Up to 2500 UPH/module
Wafer Flip Chip Size:
0.5 to 50 mm
Wafer Flip Chip Without Dipping Placement Speed:
Up to 3200 UPH/module
Wafer Size:
2 to 12 Inches
X Y Placement Accuracy:
± 10 µm
more info
Datacon 2200 evo advanced Image
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BE Semiconductor Industries N.V. - Datacon 2200 evo advanced

Die Bonder from BE Semiconductor Industries N.V.
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Bond Force:
0.5 to 25 N programmable
Bonding Method:
Die Bonder
Chip Trays Waffle Pack:
51 x 51 mm, 102 x 102 mm
Frame Size:
FF070, FF105, FF108, FF123
Heated Bond Head:
Up to 450 Degree C
Net Weight:
1300 kg
Overall Dimensions:
1160 x 1225 x 1750 mm
Standard Bond Head:
0 Degree to 360 Degree rotation
Substrate Working Range:
325 x 200 mm
Theta Placement Accuracy:
± 0.07 Degree
Type:
Automatic
Wafer Die attach Placement Speed:
Up to 7000 UPH
Wafer Die Attach Size:
0.15 to 30 mm
Wafer Die Thickness:
>50 µm
Wafer Flip Chip Placement Speed:
Up to 2500 UPH/module
Wafer Flip Chip Size:
0.05 to 30 mm
Wafer Flip Chip Without Dipping Placement Speed:
Up to 3200 UPH/module
Wafer Size:
4 to 12 Inches
X Y Placement Accuracy:
± 3 µm
more info
Datacon 2200 evo hF Image
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BE Semiconductor Industries N.V. - Datacon 2200 evo hF

Die Bonder from BE Semiconductor Industries N.V.
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Bond Force:
0.5 to 500 N
Bonding Method:
Die Bonder
Chip Trays Waffle Pack:
51 x 51 mm, 102 x 102 mm
Heated Bond Head:
450 Degree C
Overall Dimensions:
1160 x 1225 x 1800 mm
Standard Bond Head:
0 Degree to 360 Degree rotation
Substrate Working Range:
300 x 175 mm
Theta Placement Accuracy:
±0.15 Degree
Type:
Automatic
Wafer Die Attach Size:
0.17 to 50 mm
Wafer Die Thickness:
0.17 to 7 mm
Wafer Size:
2 to 12 Inches
X Y Placement Accuracy:
± 10 µm
more info
Datacon 2200 evo hS Image
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BE Semiconductor Industries N.V. - Datacon 2200 evo hS

Die Bonder from BE Semiconductor Industries N.V.
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Bond Force:
0.5 to 75 N programmable
Bonding Method:
Die Bonder
Chip Trays Waffle Pack:
51 x 51 mm, 102 x 102 mm
Frame Size:
FF070, FF105, FF108, FF123
Heated Bond Head:
450 Degree C
Net Weight:
1300 kg
Overall Dimensions:
1160 x 1225 x 1750 mm
Standard Bond Head:
0 Degree to 360 Degree rotation
Substrate Working Range:
325 x 200 mm
Theta Placement Accuracy:
± 0.10 Degree
Type:
Automatic
Wafer Die attach Placement Speed:
Up to 12000 UPH
Wafer Die Attach Size:
0.18 to 5 mm
Wafer Die Thickness:
0.05 to 2 mm
Wafer Size:
4 to 12 Inches
X Y Placement Accuracy:
± 7 µm
more info
Datacon 2200 evo plus Image
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BE Semiconductor Industries N.V. - Datacon 2200 evo plus

Die Bonder from BE Semiconductor Industries N.V.
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Bond Force:
0.5 to 75 N programmable
Bonding Method:
Die Bonder
Chip Trays Waffle Pack:
51 x 51 mm, 102 x 102 mm
Frame Size:
FF070, FF105, FF108, FF123
Heated Bond Head:
Up to 450 Degree C
Net Weight:
1300 kg
Overall Dimensions:
1160 x 1225 x 1750 mm
Standard Bond Head:
0 Degree to 360 Degree rotation
Substrate Working Range:
325 x 200 mm
Theta Placement Accuracy:
± 0.10 Degree
Type:
Automatic
Wafer Die attach Placement Speed:
Up to 7000 UPH
Wafer Die Attach Size:
0.15 to 30 mm
Wafer Die Thickness:
>50 µm
Wafer Flip Chip Placement Speed:
Up to 2500 UPH/module
Wafer Flip Chip Size:
0.5 to 30 mm
Wafer Flip Chip Without Dipping Placement Speed:
Up to 3200 UPH/module
Wafer Size:
2 to 12 Inches
X Y Placement Accuracy:
± 7 µm
more info
Datacon 8800 CHAMEO advanced Image
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BE Semiconductor Industries N.V. - Datacon 8800 CHAMEO advanced

Die Bonder from BE Semiconductor Industries N.V.
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Bond Force:
0.5 to 50 N
Bonding Method:
Flip Chip Bonder
Field of View:
12 x 12 mm
Overall Dimensions:
1600 x 1200 x 1880 mm
Type:
Automatic
Wafer Die Attach Size:
0.3 to 30 mm
Wafer Die Thickness:
50 µm to 3 mm
Wafer Flip Chip Placement Speed:
6000 UPH
Wafer Flip Chip Without Dipping Placement Speed:
Up to 9000 UPH
X Y Placement Accuracy:
± 5 µm at 3 sigma
more info
Datacon 8800 FC QUANTUM advanced Image
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BE Semiconductor Industries N.V. - Datacon 8800 FC QUANTUM advanced

Die Bonder from BE Semiconductor Industries N.V.
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Bond Force:
200 to 5000 g
Bonding Method:
Flip Chip Bonder
Field of View:
12 x 12 mm
Net Weight:
2000 kg
Overall Dimensions:
1600 x 1200 x 1940 mm
Substrate Working Range:
330 x 203 mm
Type:
Automatic
Wafer Die Attach Size:
0.3 to 20 mm
Wafer Die Thickness:
50 µm to 3 mm
Wafer Flip Chip Placement Speed:
Up to 10000 UPH
Wafer Size:
4 to 12 Inches
X Y Placement Accuracy:
± 5 µm at 3 sigma
more info
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