1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Die Bonders
Filters

Die Bonders - Page 9

125 Die Bonders from 31 Manufacturers meet your specification.
iStack S+ Image
 Download Datasheet  Request Information  Product Details

Kulicke and Soffa Industries, Inc - iStack S+

Die Bonder from Kulicke and Soffa Industries, Inc
 Download Datasheet  Request Information
Bond Force:
0.5 to 25 N
Bonding Method:
Die Bonder
Bonding Tool Setting Temperature:
Up to 250 Degree C
Overall Dimensions:
2165 x 1280 x 1995 mm
Standard Bond Head:
360 Degree
Substrate Thickness:
0.08 to 0.8 mm
Substrate Working Range:
300 x 120 mm
Theta Placement Accuracy:
50 to 150 Degree
Type:
Automatic
Wafer Die attach Placement Speed:
9000 UPH
Wafer Die Attach Size:
0.5 to 25 mm
Wafer Die Thickness:
15 µm
Wafer Size:
6 Inches, 8 Inches, 12 Inches
X Y Placement Accuracy:
± 10 µm
more info
iStack W+ Image
 Download Datasheet  Request Information  Product Details

Kulicke and Soffa Industries, Inc - iStack W+

Die Bonder from Kulicke and Soffa Industries, Inc
 Download Datasheet  Request Information
Bond Force:
0.5 to 25 N
Bonding Method:
Die Bonder
Bonding Tool Setting Temperature:
Up to 200 Degree C
Overall Dimensions:
2100 x 1930 x 1995 mm
Standard Bond Head:
360 Degree
Substrate Working Range:
152 mm, 203 mm, 305 mm
Type:
Automatic
Wafer Die attach Placement Speed:
5000 UPH, 9000 UPH
Wafer Die Attach Size:
0.8 to 15 mm
Wafer Die Thickness:
15 µm
Wafer Size:
6 Inches, 8 Inches, 12 Inches
X Y Placement Accuracy:
5 µm
more info
Katalyst Image
 Download Datasheet  Request Information  Product Details

Kulicke and Soffa Industries, Inc - Katalyst

Die Bonder from Kulicke and Soffa Industries, Inc
 Download Datasheet  Request Information
Bond Force:
0.5 to 25 N
Bonding Method:
Flip Chip Bonder
Substrate Thickness:
0.1 to 6 mm
Substrate Working Range:
340 x 340 mm
Type:
Automatic
Wafer Die Attach Size:
1 to 15.5 mm
Wafer Die Thickness:
50 µm
Wafer Flip Chip Placement Speed:
15000 UPH
Wafer Size:
8 Inches, 12 Inches
X Y Placement Accuracy:
3 µm
more info
6200 Image
 Download Datasheet  Request Information  Product Details

MicroAssembly Technologies, Ltd - 6200

Die Bonder from MicroAssembly Technologies, Ltd
 Download Datasheet  Request Information
Bond Force:
40 to 9000 g
Bonding Method:
Die Bonder
Net Weight:
Under 200 kg
Overall Dimensions:
970 x 850 x 650 mm
Substrate Working Range:
6 x 6 Inches
Type:
Automatic
Wafer Die attach Placement Speed:
Up to 600 CPH
Wafer Die Attach Size:
0.006 to 2 Inches
X Y Placement Accuracy:
± 3 µm
more info
6400 Image
 Download Datasheet  Request Information  Product Details

MicroAssembly Technologies, Ltd - 6400

Die Bonder from MicroAssembly Technologies, Ltd
 Download Datasheet  Request Information
Bond Force:
40 to 4000 g
Bonding Method:
Die Bonder
Chip Trays Waffle Pack:
Up to 30 Waffle/Gel packs
Substrate Working Range:
10 x 12 Inches
Type:
Automatic
Wafer Die attach Placement Speed:
Up to 1000 CPH
Wafer Die Attach Size:
0.006 to 1 Inches
Wafer Size:
300 mm
X Y Placement Accuracy:
± 3 µm
more info
6500 Image
 Download Datasheet  Request Information  Product Details

MicroAssembly Technologies, Ltd - 6500

Die Bonder from MicroAssembly Technologies, Ltd
 Download Datasheet  Request Information
Bond Force:
40 to 9000 g
Bonding Method:
Die Bonder
Chip Trays Waffle Pack:
Up to 40 Waffle/Gel packs
Net Weight:
350 kg
Substrate Working Range:
20 x 12 Inches
Type:
Automatic
Wafer Die attach Placement Speed:
Up to 1000 CPH
Wafer Die Attach Size:
0.006 to 2 Inches
Wafer Size:
300 mm
X Y Placement Accuracy:
± 3 µm
more info
6900/6920 Image
 Download Datasheet  Request Information  Product Details

MicroAssembly Technologies, Ltd - 6900/6920

Die Bonder from MicroAssembly Technologies, Ltd
 Download Datasheet  Request Information
Bond Force:
50 to 3000 g
Bond Head:
2 Heads
Bonding Method:
Die Bonder
Chip Trays Waffle Pack:
Up to 70 Waffle/Gel packs
Overall Dimensions:
1219 x 813 x 1854 mm
Substrate Working Range:
26 x 19 Inches
Type:
Automatic
Wafer Die attach Placement Speed:
Up to 3000 CPH
Wafer Die Attach Size:
0.010 to 1 Inches
Wafer Die Thickness:
0.002 Inches
Wafer Size:
8 Inches
X Y Placement Accuracy:
15 µm at 3 sigma
more info
NM-EFF1B Image
 Download Datasheet  Request Information  Product Details

Panasonic Corporation - NM-EFF1B

Die Bonder from Panasonic Corporation
 Download Datasheet  Request Information
Bond Force:
0.5 to 10 N
Bond Head:
24 Heads
Bonding Cycle Time:
0.56 s / IC, 0.75 s/ IC
Bonding Method:
Die Bonder
Compressed Air:
0.5 Mpa 30 L/min
Heated Bond Head:
Up to 250 Degree C, Up to 300 Degree C
Net Weight:
2200 kg
Number of Die Types:
Up to 12 types
Overall Dimensions:
1950 x 1190 x 1720 mm
Power Supply:
3 phase AC 200 V ±10V, 50/60 Hz, 4 KVA
Standard Bond Head:
Up to 300 Degree C
Substrate Working Range:
280 x 140 mm, 200 x 150 mm
Type:
Automatic
Wafer Die Attach Size:
0.25 x 0.25 mm to 6 x 6 mm
X Y Placement Accuracy:
7 µm, 15 µm, 25 µm
more info
NM-EFF1C Image
 Download Datasheet  Request Information  Product Details

Panasonic Corporation - NM-EFF1C

Die Bonder from Panasonic Corporation
 Download Datasheet  Request Information
Bond Force:
1 to 50 N
Bonding Cycle Time:
0.65 s/IC
Bonding Method:
Flip Chip Bonder
Compressed Air:
0.4 Mpa 50 L/min
Net Weight:
2300 kg
Number of Die Types:
Up to 12 types
Overall Dimensions:
1380 x 1640 x 1430 mm
Power Supply:
3 phase AC 200 V ±10V, 50/60 Hz, 4 KVA
Substrate Working Range:
330 x 330 mm
Type:
Automatic
Wafer Die Attach Size:
25 x 25 mm
Wafer Size:
305 mm
X Y Placement Accuracy:
5 µm
more info
NM-EFF1D Image
 Download Datasheet  Request Information  Product Details

Panasonic Corporation - NM-EFF1D

Die Bonder from Panasonic Corporation
 Download Datasheet  Request Information
Bond Force:
1 to 50 N
Bonding Cycle Time:
0.65 s/IC
Bonding Method:
Die Bonder
Net Weight:
1750 kg
Number of Die Types:
Up to 12 types
Overall Dimensions:
1340 x 1140 x 1400 mm
Power Supply:
3 phase AC 200 V ±10V, 50/60 Hz, 1.7 KVA
Substrate Working Range:
120 x 120 mm
Type:
Automatic
Wafer Die Attach Size:
6 x 6 mm
Wafer Size:
305 mm
X Y Placement Accuracy:
7 µm
more info
Have a Custom Requirement?
Die Bonders Directory