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Die Bonders - Page 6

125 Die Bonders from 31 Manufacturers meet your specification.
BESTEM-D511plus Image
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Canon Machinery Inc - BESTEM-D511plus

Die Bonder from Canon Machinery Inc
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Bonding Cycle Time:
0.39 sec/cycle
Bonding Method:
Die Bonder
Compressed Air:
0.4 MPa (60L/min)
Frame Size:
300 x 102 mm
Net Weight:
1600 kg
Overall Dimensions:
1900 x 1400 x 1600 mm
Power Supply:
AC200V 30A
Substrate Thickness:
0.075 to 2.0 mm
Type:
Automatic
Wafer Die Attach Size:
0.025 to 1.0 mm
Wafer Die Thickness:
0.025 to 1.0 mm
Wafer Size:
12 Inches
X Y Placement Accuracy:
±20 µm
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BESTEM-D540 Image
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Canon Machinery Inc - BESTEM-D540

Die Bonder from Canon Machinery Inc
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Bonding Cycle Time:
0.6 sec/cycle
Bonding Method:
Die Bonder
Chip Size:
3 mm
Compressed Air:
0.4 MPa (60L/min)
Frame Size:
260 x 100 mm
Net Weight:
2000 kg
Overall Dimensions:
2205 x 1415 x 1708 mm
Power Supply:
AC200V 30A
Substrate Thickness:
0.1 to 2.0 mm
Type:
Automatic
Wafer Die Attach Size:
0.5 to 11 mm
Wafer Die Thickness:
0.1 to 0.5 mm
Wafer Size:
12 Inches
X Y Placement Accuracy:
±38 µm
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BESTEM-D610 Image
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Canon Machinery Inc - BESTEM-D610

Die Bonder from Canon Machinery Inc
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Bonding Method:
Die Bonder
Chip Size:
0.5 mm
Compressed Air:
0.4 MPa (60L/min)
Frame Size:
300 x 102 mm
Net Weight:
1650 kg
Overall Dimensions:
2275 x 1475 x 1680 mm
Power Supply:
AC200V 30A
Substrate Thickness:
0.075 to 2.0 mm
Type:
Automatic
Wafer Die attach Placement Speed:
16500 UPH
Wafer Die Attach Size:
0.3 to 15.0 mm
Wafer Die Thickness:
0.05 to 0.5 mm
Wafer Size:
12 Inches
X Y Placement Accuracy:
±20 µm
more info
BESTEM-D631 Image
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Canon Machinery Inc - BESTEM-D631

Die Bonder from Canon Machinery Inc
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Bonding Cycle Time:
1.03 sec/chip
Bonding Method:
Die Bonder
Chip Size:
3 mm
Compressed Air:
0.5 MPa (150L/min)
Frame Size:
315 x 115 x 200 mm
Net Weight:
2000 kg
Overall Dimensions:
2422 x 1727.5 x 2332 mm
Power Supply:
AC200V 20A
Type:
Automatic
Wafer Die Attach Size:
1.0 to 18.0 mm
Wafer Die Thickness:
0.025 to 1.0 mm
Wafer Size:
12 Inches
X Y Placement Accuracy:
± 7 µm
more info
AvantGo 2060M Image
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Capcon Limited Co., Ltd - AvantGo 2060M

Die Bonder from Capcon Limited Co., Ltd
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Bond Force:
120 to 3200 g
Bond Head:
12 Heads
Bonding Method:
Die Bonder
Overall Dimensions:
1480 x 1560 x 1870 mm
Substrate Working Range:
330 x 260 mm
Type:
Automatic
Wafer Die attach Placement Speed:
8000 UPH
Wafer Die Attach Size:
0.5 to 30 mm, 30 to 70 mm
Wafer Size:
12 Inches, 8 Inches
X Y Placement Accuracy:
5 µm
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AvantGo 2060P Image
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Capcon Limited Co., Ltd - AvantGo 2060P

Die Bonder from Capcon Limited Co., Ltd
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Bond Force:
120 to 3200 g
Bond Head:
12 Heads
Bonding Method:
Die Bonder
Heated Bond Head:
160 Degree C
Overall Dimensions:
1480 x 1560 x 1870 mm
Substrate Working Range:
330 x 160 mm
Type:
Automatic
Wafer Die attach Placement Speed:
8000 UPH
Wafer Die Attach Size:
0.5 to 30 mm, 30 to 70 mm
Wafer Size:
12 Inches, 8 Inches
X Y Placement Accuracy:
5 µm
more info
AvantGo 2060W Image
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Capcon Limited Co., Ltd - AvantGo 2060W

Die Bonder from Capcon Limited Co., Ltd
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Bond Force:
120 to 3200 g
Bond Head:
12 Heads
Bonding Method:
Die Bonder
Heated Bond Head:
160 Degree C
Overall Dimensions:
1480 x 1560 x 1870 mm
Substrate Working Range:
320 x 320 mm
Type:
Automatic
Wafer Die attach Placement Speed:
11000 UPH
Wafer Die Attach Size:
0.5 to 30 mm, 30 to 70 mm
Wafer Size:
12 Inches, 8 Inches
X Y Placement Accuracy:
5 µm
more info
AvantGo A2 Image
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Capcon Limited Co., Ltd - AvantGo A2

Die Bonder from Capcon Limited Co., Ltd
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Bond Force:
120 to 5000 g
Bond Head:
4 Heads
Bonding Method:
Die Bonder
Heated Bond Head:
160 Degree C
Overall Dimensions:
1450 x 1775 x 1529 mm
Substrate Working Range:
330 x 330 mm
Type:
Automatic
Wafer Die attach Placement Speed:
3000 UPH
Wafer Die Attach Size:
0.5 to 30 mm, 30 to 100 mm
Wafer Size:
12 Inches, 8 Inches
X Y Placement Accuracy:
1.5 µm
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AvantGo A4 Image
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Capcon Limited Co., Ltd - AvantGo A4

Die Bonder from Capcon Limited Co., Ltd
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Bond Force:
120 to 3200 g
Bond Head:
8 Heads
Bonding Method:
Die Bonder
Heated Bond Head:
160 Degree C
Overall Dimensions:
1480 x 1560 x 1870 mm
Substrate Working Range:
330 x 300 mm
Type:
Automatic
Wafer Die Attach Size:
0.5 to 100 mm
Wafer Size:
12 Inches
X Y Placement Accuracy:
3 µm
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AvantGo A6 Image
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Capcon Limited Co., Ltd - AvantGo A6

Die Bonder from Capcon Limited Co., Ltd
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Bond Force:
120 to 3200 g
Bond Head:
12 Heads
Bonding Method:
Die Bonder
Heated Bond Head:
160 Degree C
Overall Dimensions:
1480 x 1560 x 1870 mm
Substrate Working Range:
330 x 300 mm
Type:
Automatic
Wafer Die attach Placement Speed:
up to 11000 UPH
Wafer Die Attach Size:
0.5 to 30 mm, 30 to 100 mm
Wafer Size:
12 Inches
X Y Placement Accuracy:
3 µm
more info
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