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Die Bonders - Page 5

125 Die Bonders from 31 Manufacturers meet your specification.
DU9721 Image
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BOZHON Precision Industry Technology Co., Ltd - DU9721

Die Bonder from BOZHON Precision Industry Technology Co., Ltd
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Bond Force:
20 to 500 g
Bonding Method:
Die Bonder
Type:
Automatic
Wafer Size:
12 Inches
X Y Placement Accuracy:
± 7 µm
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EF8622 Image
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BOZHON Precision Industry Technology Co., Ltd - EF8622

Die Bonder from BOZHON Precision Industry Technology Co., Ltd
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Bonding Cycle Time:
12 to 50 s/pcs
Bonding Method:
Die Bonder
Type:
Automatic
X Y Placement Accuracy:
± 0.5 to 3 µm
more info
EH9722 Image
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BOZHON Precision Industry Technology Co., Ltd - EH9722

Die Bonder from BOZHON Precision Industry Technology Co., Ltd
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Bonding Cycle Time:
12 to 50 s/pcs
Bonding Method:
Die Bonder
Type:
Automatic
X Y Placement Accuracy:
± 0.5 to 3 µm
more info
BESTEM-C310 Image
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Canon Machinery Inc - BESTEM-C310

Die Bonder from Canon Machinery Inc
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Bonding Cycle Time:
1.2 sec/cycle
Bonding Method:
Clip Bonder
Clip Hoop Frame:
9 to 60 mm
Compressed Air:
0.4 MPa (60L/min)
Frame Size:
300 x 100 mm
Net Weight:
1400 kg
Overall Dimensions:
2557 x 1473 x 2045 mm
Power Supply:
AC 200 V 30 A
Substrate Thickness:
0.075 to 0.6 mm
Type:
Automatic
Wafer Die Attach Size:
0.8 to 10 mm
Wafer Die Thickness:
0.1 to 1 mm
X Y Placement Accuracy:
± 68 µm
more info
BESTEM-D310 Image
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Canon Machinery Inc - BESTEM-D310

Die Bonder from Canon Machinery Inc
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Bonding Cycle Time:
0.180 sec/cycle
Bonding Method:
Die Bonder
Compressed Air:
0.4 MPa (60L/min)
Frame Size:
300 x 102 mm
Net Weight:
1500 kg
Overall Dimensions:
1860 x 1282 x 1622 mm
Power Supply:
AC 200V 15A
Substrate Thickness:
0.1 to 3 mm
Type:
Automatic
Wafer Die Attach Size:
0.3 to 8 mm
Wafer Die Thickness:
0.1 to 0.5 mm
Wafer Size:
8 Inches max
X Y Placement Accuracy:
± 25 µm
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BESTEM-D311plus Image
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Canon Machinery Inc - BESTEM-D311plus

Die Bonder from Canon Machinery Inc
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Bonding Cycle Time:
0.300 sec/cycle
Bonding Method:
Die Bonder
Compressed Air:
0.4 MPa (60L/min)
Frame Size:
260 x 102 mm
Net Weight:
1500 kg
Overall Dimensions:
1860 x 1282 x 1622 mm
Power Supply:
AC200V 15A
Substrate Thickness:
0.1 to 1 mm
Type:
Automatic
Wafer Die Attach Size:
0.3 to 8.0 mm
Wafer Die Thickness:
0.15 to 2 mm
Wafer Size:
8 Inches
X Y Placement Accuracy:
±15 µm
more info
BESTEM-D320 Image
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Canon Machinery Inc - BESTEM-D320

Die Bonder from Canon Machinery Inc
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Bonding Cycle Time:
0.185 sec/cycle
Bonding Method:
Die Bonder
Compressed Air:
0.4 MPa (60L/min)
Frame Size:
300 x 100 mm
Net Weight:
1500 kg
Overall Dimensions:
1860 x 1282 x 1622 mm
Power Supply:
AC 200 V 20 A
Substrate Thickness:
0.1 to 1 mm
Type:
Automatic
Wafer Die Attach Size:
0.1 to 1.5 mm
Wafer Size:
8 Inches max
X Y Placement Accuracy:
± 38 µm
more info
BESTEM-D340 Image
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Canon Machinery Inc - BESTEM-D340

Die Bonder from Canon Machinery Inc
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Bonding Cycle Time:
0.6 sec/cycle
Bonding Method:
Die Bonder
Chip Size:
3 mm
Compressed Air:
0.4 MPa (60L/min)
Frame Size:
300 x 100 mm
Net Weight:
1550 kg
Overall Dimensions:
1860 x 1320 x 1622 mm
Power Supply:
AC200V 30A
Substrate Thickness:
0.1 to 2 mm
Type:
Automatic
Wafer Die Attach Size:
0.5 to 11 mm
Wafer Die Thickness:
0.1 to 0.5 mm
Wafer Size:
8 Inches max
X Y Placement Accuracy:
± 38 µm
more info
BESTEM-D510 Image
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Canon Machinery Inc - BESTEM-D510

Die Bonder from Canon Machinery Inc
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Bonding Cycle Time:
0.257 sec/cycle
Bonding Method:
Die Bonder
Compressed Air:
0.4 MPa (60L/min)
Frame Size:
300 x 102 mm
Net Weight:
1600 kg
Overall Dimensions:
1930 x 1400 x 1600 mm
Power Supply:
AC 200 V 30 A
Substrate Thickness:
0.075 to 2 mm
Type:
Automatic
Wafer Die Attach Size:
3 to 8 mm
Wafer Die Thickness:
0.075 to 2 mm
Wafer Size:
12 Inches max
X Y Placement Accuracy:
± 25 µm
more info
BESTEM-D511f plus Image
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Canon Machinery Inc - BESTEM-D511f plus

Die Bonder from Canon Machinery Inc
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Bonding Cycle Time:
0.45 sec/cycle
Bonding Method:
Flip Chip Bonder
Compressed Air:
0.4 MPa (60L/min)
Frame Size:
300 x 102 mm
Net Weight:
1600 kg
Overall Dimensions:
1900 x 1400 x 1600 mm
Power Supply:
AC200V 30A
Substrate Thickness:
0.075 to 2 mm
Type:
Automatic
Wafer Die Attach Size:
0.3 to 8 mm
Wafer Die Thickness:
0.075 to 5.0 mm
Wafer Size:
12 Inches max
X Y Placement Accuracy:
± 12 µm
more info
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