1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Die Bonders
Filters

Die Bonders - Page 13

125 Die Bonders from 31 Manufacturers meet your specification.
Eutectic Die Bonder Image
 Download Datasheet  Request Information  Product Details

Shenzhen Liande Automation Equipment Co., Ltd - Eutectic Die Bonder

Die Bonder from Shenzhen Liande Automation Equipment Co., Ltd
 Download Datasheet  Request Information
Bond Force:
30 to 500 g
Bonding Method:
Die Bonder
Overall Dimensions:
760 x 610 x 1300
Type:
Automatic
Wafer Die attach Placement Speed:
17000 to 18000 UPH
Wafer Size:
6 Inches, 8 Inches
X Y Placement Accuracy:
=±38 µm
more info
COF Flip Eutectic Bonding Machine Image
 Download Datasheet  Request Information  Product Details

Shenzhen Liande Automation Equipment Co., Ltd - COF Flip Eutectic Bonding Machine

Die Bonder from Shenzhen Liande Automation Equipment Co., Ltd
 Download Datasheet  Request Information
Bond Force:
10 to 350 N
Bonding Cycle Time:
1.5 sec
Bonding Method:
Die Bonder, Flip Chip Bonder
Chip Size:
25 x 5 mm
Substrate Thickness:
25 to 112 µm
Substrate Working Range:
35 mm, 48 mm, 70 mm
Temperature Uniformity:
200 to 450 Degree C
Type:
Automatic
Wafer Chip Thickness:
0.2 to 1 mm
Wafer Die attach Placement Speed:
2000 UPH
Wafer Size:
8 Inches, 12 Inches
X Y Placement Accuracy:
±1.5 µm
more info
HWS100-N Image
 Download Datasheet  Request Information  Product Details

HIGHLYWIN - HWS100-N

Die Bonder from HIGHLYWIN
 Download Datasheet  Request Information
Bonding Cycle Time:
65 ms
Bonding Method:
Die Bonder
Chip Size:
0.0762 x 0.0762 mm to 20.32 x 2.032 mm
Compressed Air:
0.5 Mpa 40 L/min
Power Supply:
AC 220V 50 Hz, 1.6 KW
Type:
Automatic
Wafer Size:
6 Inches
X Y Placement Accuracy:
±1 mil
more info
HW812 Image
 Download Datasheet  Request Information  Product Details

HIGHLYWIN - HW812

Die Bonder from HIGHLYWIN
 Download Datasheet  Request Information
Bonding Method:
Die Bonder
Chip Size:
0.381 x 0.381 mm to 5.08 x 5.08 mm
Compressed Air:
0.5 Mpa
Power Supply:
AC 220V 50 Hz
Type:
Automatic
Wafer Die attach Placement Speed:
17000 UPH
Wafer Size:
12 Inches
X Y Placement Accuracy:
20 µm
more info
DBD4200R Image
 Download Datasheet  Request Information  Product Details

E-Globaledge Corporation - DBD4200R

Die Bonder from E-Globaledge Corporation
 Download Datasheet  Request Information
Bond Force:
19.6 to 122 cN
Bonding Cycle Time:
0.15 sec/chip
Bonding Method:
Die Bonder
Bonding Tool Setting Temperature:
500 Degree C
Chip Size:
0.25 to 0.80 mm
Compressed Air:
0.4 MPa
Net Weight:
750 kg
Overall Dimensions:
1100 x 1100 x 1880 mm
Power Supply:
200 VAC, 50/60 Hz
Type:
Automatic
Wafer Die Attach Size:
20 to 60 mm
Wafer Size:
6 Inches, 8 Inches
X Y Placement Accuracy:
±50 µm
more info
Have a Custom Requirement?
Die Bonders Directory